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Reliability of Printed Circuit Assemblies

Freda, Michael, and Furlong, Jason, Application of Reliability/Survival Statistics to Analyze Interconnect Stress Test Data to Make Life Predictions on Complex, Lead-Free Printed Circuit Assemblies, EPC 2004, October 2004. [Pg.236]

FIGURE 46.2 A BGA solder joint rife with voids from flux-derived gases and improper soldering profile. These voids can detract from the reliability of the solder joint. The IPC-A-610 workmanship standard for printed circuit assemblies (PCAs) should be consulted on void acceptability. (Courtesy of Hewlett-Packard.)... [Pg.1058]

PTH reliability and on the reliability of the solder joints made to these pads. Common metal finishes for solder-mask-over-bare-copper (SMOBC) boards inclnde hot-air solder leveling (HAST or HAL), organic-coated copper (OCC), and electroless NiAn. Galvanically plated CuNiAu and CuNiSn made by another processing route are also available.These finishes provide a solderable finish for later printed circuit assembly. The pros and cons of the various finishes are discussed in turn. [Pg.1346]

Reliability of electronic assemblies is a complex subject.This chapter has touched on only one aspect of the problem understanding the primary failure mechanisms of printed circuit boards and the interconnects between these boards and the electronic components mounted on them. This approach provides the basis for analyzing the impact of design and materials choices and manufacturing processes on printed circuit assembly reliabihty. It also provides the foundation for developing accelerated testing schemes to determine reliability. It is hoped that the fundamental approach will enable the reader to apply this methodology to new problems not yet addressed in mainstream literature. [Pg.1361]

Pricing as well as reliability considerations have led to an almost exclusive use of Si-based (i.e. Si and SOI) micro machined devices. Packaging and assembly has focused on ceramics (A1203, AIN, Low Temperature Co-fired Ceramics LTCC), Printed Circuit Board (PCB-) and Surface Mount Device (SMD-) technology and multichip modules (MCM s). [Pg.200]

See other pages where Reliability of Printed Circuit Assemblies is mentioned: [Pg.1317]    [Pg.1319]    [Pg.1321]    [Pg.1323]    [Pg.1325]    [Pg.1327]    [Pg.1329]    [Pg.1333]    [Pg.1335]    [Pg.1337]    [Pg.1339]    [Pg.1341]    [Pg.1343]    [Pg.1345]    [Pg.1347]    [Pg.1351]    [Pg.1355]    [Pg.1357]    [Pg.1359]    [Pg.1361]    [Pg.1363]    [Pg.1317]    [Pg.1319]    [Pg.1321]    [Pg.1323]    [Pg.1325]    [Pg.1327]    [Pg.1329]    [Pg.1333]    [Pg.1335]    [Pg.1337]    [Pg.1339]    [Pg.1341]    [Pg.1343]    [Pg.1345]    [Pg.1347]    [Pg.1351]    [Pg.1355]    [Pg.1357]    [Pg.1359]    [Pg.1361]    [Pg.1363]    [Pg.1140]    [Pg.1243]    [Pg.1397]    [Pg.1422]    [Pg.124]    [Pg.124]    [Pg.36]    [Pg.1037]    [Pg.1038]    [Pg.1145]    [Pg.1167]    [Pg.1317]    [Pg.1367]    [Pg.1369]    [Pg.440]    [Pg.125]    [Pg.228]    [Pg.228]    [Pg.368]    [Pg.125]    [Pg.19]    [Pg.1]    [Pg.262]   


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PRINTED CIRCUIT

Printed-circuit assemblies

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