Reaction cured glass

Plastics - differential scanning calorimetry - general principles Determination of characteristic reaction cure temperatures and times, enthalpy of reaction and degree of conversion Glass-transition temperature and cure factor for laminates and printed circuit hoards Replaced hy ASTM D3418... 

Figure 2.2c shows the evolution of the corrected heat flow phase, (p. The fully-cured glass state is always used as a reference (zero value) for the instrument correction [68, 69]. The phase angle corrected in this way has a small negative value, tending to more positive values due to the chemical reactions. Indeed, in Figure 2.2c the corrected heat flow phase, (p, initially amounts to —2.0° and then slowly evolves toward zero as the reaction proceeds. Relaxation phenomena are superimposed as local (downward) extremes. Thus, the (downward) local extreme in (p observed at 83 min confirms the vitrification process observed in Cp in Figure 2.2b. At the end of the quasi-isothermal experiment, (p equals —0.6°.

Chemical reactions, for example, dehydrations, decompositions, polymer curing, glass formation, oxidative stability, reaction kinetics, etc. 

When the cure temperature is below the full cure glass transition of the epoxy-amine (Tg = 95 C), vitrification of the epoxy-amine-rich phase also takes place. This clearly occurs in Hg. 2.116 for the reaction at 80°C.The heat flow phase angle is important in this respect, showing a second relaxation peak. Partial vitrification is seen at 90 C, and it is again most obvious in the heat flow phase or phase angle. 

During structural adhesive bonding, circumstances may arise where the use of a temperature different from that recommended by the adhesive manufacturer is either deliberately sought or inadvertently applied. An understanding of the relationship between chemical composition, cure temperature, extent of reaction and glass transition temperature (Tg) is especially important if a product suitable for the application is to be obtained. 

Polymerization. Thermal polymerization or curing of an ink film at elevated temperatures can foUow many different chemical paths. Condensation and cross-linking reactions may be accompHshed with or without the use of catalysts. However, this method of drying generally has not been widely used for printing inks, except those used for metal and glass decoration, and some clear coatings. 

Resin-modified glass—ionomer lining and restorative materials add a multifunctional acidic monomer to the poly(acryhc acid) [9003-01 Hquid component of the system. Once the glass powder and Hquid are mixed, setting can proceed by the acid—glass—ionomer reaction or the added monomer can be polymerized by a free-radical mechanism to rapidly fix the material in place (74,75). The cured material stiH retains the fluoride releasing capabiHties of a glass—ionomer. 

Other modifications of the polyamines include limited addition of alkylene oxide to yield the corresponding hydroxyalkyl derivatives (225) and cyanoethylation of DETA or TETA, usuaHy by reaction with acrylonitrile [107-13-1/, to give derivatives providing longer pot Hfe and better wetting of glass (226). Also included are ketimines, made by the reaction of EDA with acetone for example. These derivatives can also be hydrogenated, as in the case of the equimolar adducts of DETA and methyl isobutyl ketone [108-10-1] or methyl isoamyl ketone [110-12-3] (221 or used as is to provide moisture cure performance. Mannich bases prepared from a phenol, formaldehyde and a polyamine are also used, such as the hardener prepared from cresol, DETA, and formaldehyde (228). Other modifications of polyamines for use as epoxy hardeners include reaction with aldehydes (229), epoxidized fatty nitriles (230), aromatic monoisocyanates (231), or propylene sulfide [1072-43-1] (232). 

The cross-linking reaction is carried out after the resin has been applied to the glass fibre. In practice the curing is carried out either at elevated temperatures of about 100°C where press mouldings are being produced, or at room temperature in the case of large hand lay-up structures. 

The simple relation (6.1) is quite useful. It allows an estimate of the gain or loss in yield strength if the glass transition temperature is changed, as for instance by the progress of the curing reaction, by radiation damage, or by absorption of water and of solvents. The ATe is determined fairly easily by thermoanalytical measurements. 

Preparation and thermal crosslinking reactions of oc, -vinylbenzyl terminated polysulfone-b-polydimethylsiloxane, ABA type block copolymers have been discussed 282,313) However, relatively little characterization was reported. Molecular weights of polysulfone and PDMS segments in the copolymers were varied between 800-8,000 and 500-11,000 g/mole, respectively. After thermal curing, the networks obtained showed two phase morphologies as indicated by the detection of two glass transition temperatures (—123 °C and +200 °C) corresponding to PDMS and polysulfone phases, respectively. No mechanical characterization data were provided. 

Part cures were characterized by exothermic reaction wave propagation. Figures 6a-9b show the development of the reaction waves. The waves propagate from the walls of the part towards the center. A comparison of the temperature and epoxide conversion profiles revealed that the highest temperature corresponded to the highest conversion. As the part initially heats the resin/glass matrix nearest the walls heats fastest however, as the part exotherms the temperatures in the interior of the part exceeded the wall temperatures. The center temperature does not become the hottest temperature until the waves intersect. It must be noted that the hottest temperature does not always occur at the center of the part. The wave velocities are proportional to the wall temperatures. In Figures 6a to 9b the mold temperature was 90 C and the press temperature was elevated to 115 C. Since the press does not heat the part until after it is wound, the press temperature was elevated to accelerate the reaction wave from the press so that the waves would intersect in the center of the part. 

Another development has been the advent of the dual-cure resin cements. These are hybrids of glass polyalkenoate cements and methacrylates that set both by an add-base cementation reaction and by vinyl polymerization (which may be initiated by light-curing). In these materials, the solvent is not water but a mixture of water and hydroxyethylmethacrylate which is capable of taking dimethacrylates and poly(acrylic add)-containing vinyl groups into solution. In the absence of light these materials set slowly and... 

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