Rapid expulsion phenomenon

Intestinal helminths have been used as the prototypical parasite infections to demonstrate the importance of IgE in mediating protection. Indeed, it has been demonstrated that passive transfer of IgE antibodies can mediate the rapid expulsion phenomenon in rats infected with T. spiralis (89) and that diminished levels of IgE are associated with dissemination of Strongyloides stercoralis (61,90) in the context of HTLV-I coinfection. With the elucidation of the cytokine control of the IgE response (e.g., IL-4 and IL-13), however, and the fact the these cytokine responses exist in the context of a broader (Th2 or Type 2) response, the IgE response itself may be merely an indicator of a more general response, whose many different components effect the protective response (reviewed in Refs. 91-94). 

Moisture is absorbed by adhesives and other plastic materials to various degrees and can accumulate in voids within the bond line during assembly, testing, and operation. The absorption of moisture in adhesives as well as in other polymeric materials, such as molding compounds, has been proven to cause failures when parts are subsequently solder reflowed and exposed to the high solder melt temperatures of 200 °C and above. The rapid evaporation and expulsion of the moisture result in stresses that cause cracking and delamination, a phenomenon referred to as popcorning. 

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