Process development thin-film resistor

We present here an effective way to manufacture a reproducible thin film resistor, using accepted statistical techniques. The process requirements, experimental techniques, process development and characterization, examples of control charts, their Interpretation for rapid appraisal and the Impact of statistical techniques on the production yields and future developments will be described. 

In the past, numerous thin-film techniques have been developed for various substrates and applications [29]. Regardless of process variation, thin-film interconnect technology typically consists of a dielectric substrate, such as ceramic, providing mechanical support and a heat dissipation path dielectrics separating the interconnect conductors conductors and vias forming interconnect and resistors, inductors, as well as capacitors in some applications. Once a thin-film interconnect substrate is finished, devices are populated on top of it. At this point, a functional board or card has been accomplished. The following sections describe the key aspects of thin films on ceramics the reader can consult Reference 30 and Reference 31 for more information about thin-film technology. 

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