Problems resulting from integrated circuit

A number of integrated circuit (IC) failure mechanisms are related to the presence of water and impurities at device surfaces. The most catastrophic failures are open or short circuits resulting from electrochemical attack on substrate metallization. Other, more subtle maladies include increased capacitive coupling between conductors (1.), reduced bipolar current gain (2), shifted MOS threshold voltages (3.4), and parasitic MOS devices (5.6). These problems arise from spurious electrical conduction processes in the presence of moisture and ionic contaminants. Polymer encapsulants, such as silicone rubber, provide barriers that prevent the formation of conductive water films on IC surfaces. 

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