Printed wiring rigid

Analysis of the Market for Rigid Printed Wiring Boards for 1987, T/MRC, IPC, June 1988. 

To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process. Some of the most commonly used material specifications are those that deal with laminate,prepreg, and copper foil. IPC lOl, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils. Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter. 

MIL-PRF-55110, Printed Wiring Board, Rigid, General Specification for ... 

MIL-P-50884 Military Specification for Printed Wiring, Flexible, and Rigid Flex MIL-PRF-55110 Performance Specification, Printed Wiring Boards, Rigid General Specification... 

Rigid printed wiring is used far more extensively than flexible, and in the USA accounted for about 88% of the total area produced (approximately 250 million square feet) in 1983. 

Both rigid and flexible printed wiring are further classified according to structure of which there are three basic types, as illustrated in Fig. 9.3 ... 

Fig. 9.1. Rigid printed wiring boards for computer applications.

Rigid-Flex Printed Wiring Design for Production Readiness, Walters. Rigling... 

L. Lynch and R. A. Nesbitt, Rigid printed wiring board fabrication techniques, in Electronics Materials Handbook (C. A. Dostal, ed.), ASM Int., Materials Park, OH, 1989, pp. 538-555 and references therein. 

The thermoplastics used for MID are neither as rigid nor as strong as the glass-reinforced themosets routinely used for printed-circuit boards. The layer of metal deposited on the substrate is typically hard and compensates for the poor wirebonding properties of the soft substrate material. This is why bondability is largely independent of the polymer used. It is important to bear in mind, however, that there is a minimum thickness specification for plating (Table 5.7). The thicker the metallization, the more dependable the wire-bonding process becomes. [182]... 

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