Bonding pressure

In JP-A-63170961 a shape-memory alloy structure is used to release mechanical stress generated in connection bumps during a flip-chip process comprising pressure bonding. 

A photoelectric conversion device 10 is formed in a p-type HgCdTe substrate 11 and a CCD 20 is formed in a p-type silicon substrate 13. Indium electrodes 4a and 4b, which are connected to the photoelectric conversion device and the CCD, respectively, are covered on their sides with shape-memory metal layers 5a and 5b. Pressure bonding is used to couple the photoelectric conversion device to the CCD. Thereafter, the temperature is raised to return the shape-memory metal to its original shape, at the same time releasing mechanical stress in the indium electrodes. 

No volatiles evolved during cure—no requirement for high pressure bonding operations. 

Longer chained hydrocarbon formation is much lower than expected. This is presumably because of the high hydrogen. -carbon monoxide ratio of the feed gas and because of the high pressure. Bond (1) cites both these conditions as favoring hydrogenolysis. 

Glued Laminated Beam (Glulam)- A structural beam composed of wood laminations or lams. The lams are pressure bonded with adhesives to attain a typical thickness of 1 V2. (It looks like 5 or more 2 X 4 s are glued together). 

Laminated wood is a high-pressure bonded wood product composed of layers of wood with plastic such as phenolic as the laminating agent. 

Used initially for fabricating the cladding for nuclear fuel elements. It was called gas-pressure bonding. ... 

Device Assembly The molded PDMS fluidic chambers were pressure bonded to the silicon chips (Fig. 5a, b). This chemically isolated one side of the pore from the other, thereby creating a device that enabled independent experimental control of each side of the pore (or membrane sealed over the pore). To prevent electrical leak around the silicon chip, SU-8-5 photoresist was appfied around the edges of the surface of the chip with a cotton swab (Fig. 5b) or by transferring the SU-8-5 with a PDMS stamp and then cured. This coating not only permitted a quick, greaseless method for sealing the chip surface to... 

Hysol EA 9614 (modified epoxy on a nylon carrier) has been used to give good bonds with this plastic in a steel-plastic-steel bond. " Curing is at 71°C for 4 hours, or 1 hour at 93-121°C at 0.21 MPa pressure. Bonds with strengths up to 14 MPa have been obtained with solvent-cleaned surfaces. 

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