Polymer matrix composites, filled electrical property

Polymer-matrix composites have been used as one of the most common packaging materials for encapsulating a variety of electronic components for dissipating heat [14]. In this section, 3D AlN nanowhiskers with brush-hke structure were filled into the polymer matrix to enhance its thermal conductivity. The 3D brush-hke AlN fiUers were fabricated by CS process [7a], as iUustrated in Section 3.2. The use of AlN as a filler candidate to enhance the thermal conductivity of the polymer is attributed to its attractive properties such as high thermal conductivity, high electrical resistivity, and good chemical stabihty with polymers [1]. To explore the promoting effect of the 3D brush-hke AIN fillers on thermal conductivity, three types of AIN fillers with different brush-hke filler aspect ratio were added into polymer matrix to fabricate a series of composites and their thermal conductivities were measured. The results demonstrated that the 3D brush-hke AIN nanowhiskers fillers can effectively enhance the thermal conductivity of the polymer composite. 

The thermal characteristics of NR-metal composites are close to the properties of metals, whereas the mechanical properties and the processing methods are typical of polymers.Thermally conducting, but electrically insulating, polymer-matrix composites are increasingly important for electronic packaging because the heat dissipation ability limits the reliability, performance and miniaturization of electronics.Thermal properties such as thermal conductivity, thermal dilfusivity and specific heat of metal (copper, zinc, Fe and bronze) powder-filled polymer composites are investigated experimentally in the range of filler content 0-24% by volume. ... 

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