Polyimides thermal dependence

Dimensional Stability The dimensional stability of Kapton polyimide film depends on two factors— the normal coefficient of thermal expansion and the residual stresses placed in the film during manufacturing. The latter causes Kapton to shrink on its first exposure to elevated temperatures as indicated in the bar graph in Fig. 22-05. Once the film has been exposed, the normal values for the thermal coefficient of linear expansion, as shown in Table 22-04, can be expected. ]... 

PI nanocomposites have been prepared by various methods with different fillers. The nanocomposites might have many applications starting from barrier and thermal resistance to a compound with low coefficient of thermal expansion (CTE) [154-167]. These hybrid materials show very high thermal and flame retardation as well as barrier resistance and adhesion. Tyan et al. [158] have shown that depending on the structure of the polyimide the properties vary. Chang et al. [159] have also investigated the dependency of the properties on the clay modifiers. 

Estimates of oCbiend using a rule-of-mixtures relationship are 3.0 X 102 and 7.2 X 103 cm lor 0.2 and 5.0% polyimide, respectively. This dependence of the optimum absorption coefficient (in terms of ablation rate), OVx on fluence is consistent with the observations of Chuang et al.6% for ablation of several UV-transparent (at 308 nm) polymers sensitized with low-molecular-weight dopants, e.g., PMMA doped with pyrene. For the pyrene-PMMA system, Chuang et al.6S reported maximum etch rates for 1.2 J/cm2 at a = 7 X 102 cm 1. It should not be expected that different dopant-matrix systems would yield the same optimum absorption coefficient for a given fluence level since the thermal properties for different polymers may vary significantly. 

As mentioned earlier PMR polyimide thermosts are used as matrix resins for glass- and carbon fiber composites, mainly in aeroengine applications. At this point it has to be mentioned that the thermal oxidative stability of a PMR composite is dependent on the type of fiber used (113) and the cure conditions (time/temperature/atmosphere) employed for molding. Very interesting is the observed higher thermal oxidative stability of PMR-II composites when cured/-... 

The most common advanced composites are made of thermosetting resins, such as epoxy polymers (the most popular singlematrix material), polyesters, vinyl esters, polyurethanes, polyimids, cianamids, bismaleimides, silicones, and melamine. Some of the most widely used thermoplastic polymers are polyvinyl chloride (PVC), PPE (poly[phenylene ether]), polypropylene, PEEK (poly [etheretherketone]), and ABS (acrylonitrile-butadiene-styrene). The precise matrix selected for any given product depends primarily on the physical properties desired for that product. Each type of resin has its own characteristic thermal properties (such as melting point... 

Modification of porous inorganic materials by carbon makes it possible to obtain porous carboniferous composites with high thermal and chemical stability and strength. To introduce carbon into pores, both gas phase pyrolysis and carbonization through thermochemical solid-phase reactions are employed. The formation of carbon structures depends on carbonization conditions process rate, precursor concentration, presence of catalyst, etc. [1-3]. Phenolic resins, polyimides, carbohydrates, condensed aromatic compounds are most widely used as polymeric and organic precursors[4-6]. 

Stresses in solvent based coatings arise from the differential shrinkage between the thin film coatings and the corresponding substrates. These stresses are due to volume changes associated with solvent evaporation, chemical reaction (i.e. cyclization in polyimide formation) and differences in thermal expansion coefficients of the coating and substrate (4>5). The level of residual stress depends on the material properties such as modulus, residual solvent content and crosslinking (5) and its thermal-mechanical history. 

Some general conclusion from these studies are (1) Cu/PI TFML structures have excellent thermal and mechanical stability under extremes of temperature, humidity, and radiation (2) the adhesion of polyimide is highly dependent on interface chemistry and surface preparation (3) PI rapidly absorbs and desorbs water, which has an appreciable effect on its dielectric properties and thus the electrical charactersitics of TFML interconnections the electrical design tolerances must accommodate these variations or the package must be hermetically sealed (4) properly baked and sealed TFML packages can maintain MIL-STD internal moisture levels of less than 5000 ppm at 100°C. 

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