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Polyimide photosensitive siloxane

Some new electronic applications of polyimide-siloxane adhesives have been already partially reviewed. In addition, the development of photo-crosslinkable copolymers has been of great interest for the development of components of electronic devices [126]. The general field of photosensitive polymers was reviewed by Horie and Hamishita in 1995 [127]. A number of papers have investi-... [Pg.96]

Thermal tempering of the photosensitive or cross-linked polymer gives the polyimide siloxane which has been previously shown to be an excellent candidate as an insulating polymer in electronics. The use of such a directly patternable polyimide for dielectric and passivation applications, particularly in microelectronics, should become increasingly important as polyimides become more widely accepted in the industry. [Pg.259]

The proposed chapter reviews the work done on 6FDA based fluorinated Pis with respect to its synthesis and various copolymers, polymerisation methods, poly(ether-imide), photosensitive polyimide, hyperbranched polyimide, addition polyimide, poly(amide-imide), poly(urethane-imide), poly(epoxy-imide), poly(ester-imide), poly(siloxane-imide), nanocomposites and non-linear optical polyimides. Finally, its application in electronics and use as a material for gas separation and corrosion protection are discussed. [Pg.43]


See other pages where Polyimide photosensitive siloxane is mentioned: [Pg.97]    [Pg.98]    [Pg.259]    [Pg.261]    [Pg.263]    [Pg.265]    [Pg.267]    [Pg.272]   
See also in sourсe #XX -- [ Pg.259 , Pg.260 , Pg.261 , Pg.262 , Pg.263 , Pg.264 , Pg.265 , Pg.266 , Pg.267 , Pg.268 , Pg.269 , Pg.270 , Pg.271 ]




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