Polyamide melt, additives

Molecular weight can be controlled by addition of a small amount of monobasic acid. This polyamide melts at 265°C and is highly czystaUine. The polymer can be run directly to spinning machines to produce fiber, or it can be extruded as a heavy ribbon which is chilled and chipped. The pol3uner may be remelted to spin into fiber, or it may be used for extrusion of molded objects, or it can be made into molding powders. 

The thermal protection system of the space shutde is composed mainly of subliming or melting ablators that are used below their fusion or vaporization reaction temperatures (42). In addition to the carbon-carbon systems discussed above, a flexible reusable surface insulation composed of Nomex felt substrate, a Du Pont polyamide fiber material, is used on a large portion of the upper surface. High and low temperature reusable surface insulation composed of siHca-based low density tiles are used on the bottom surface of the vehicle, which sees a more severe reentry heating environment than does the upper surface of the vehicle (43). 

The polyamide copolymer of dodecanoic acid with methylenedi(cyclohexylamine) (MDCHA, PACM) was sold as continuous filament yam fiber under the tradename QIANA. As late as 1981, over 145,000 t was produced using high percentages, typically 80%, of trans, trans MDCHA isomer. The low melting raffinate coproduct left after t,t isomer separation by fractional crystallisation was phosgenated to produce a Hquid aUphatic diisocyanate marketed by Du Pont as Hylene W. Upon terrnination of their QIANA commitment, Du Pont sold the urethane intermediate product rights to Mobay, who now markets the 20% trans, trans—50% cis, trans—30% cis, cis diisocyanate isomer mixture as Desmodur W. In addition to its use in polyamides and as an isocyanate precursor, methylenedi (cyclohexyl amine) is used directiy as an epoxy curative. The Hquid diamine mixture identified historically as PACM-20 is marketed as AMICURE PACM by Anchor Chemical for performance epoxies. 

Polyamide Resins. Another class of polyamide resins, in addition to the Hquid resins used as epoxy hardeners, are the thermoplastic type, prepared generaHy by the condensation reaction of polyamines with polybasic fatty acids. These resins find use in certain hot-melt adhesives, coatings, and inks. Diamines, typicaHy EDA (233), are the principal amine reactant however, tri- and tetramines are sometimes used at low levels to achieve specific performance. 

Many properties of polyamides are attributable to the formation of hydrogen bonds between the NH and CO groups of neighboring macromolecules. This is evidenced by their solubility in special solvents (sulfuric acid, formic acid, m-cresol), their high melting points (even when made from aliphatic components), and their resistance to hydrolysis. In addition, polyamides with a regular chain structure crystallize very readily. 

As a consequence of this almost perfect alignment of molecule structures, such polyamides are able to orientate in solution and to form liquid crystalline phases (see Sect. 1.3.4). Out of these solutions one obtains fibers of poly(p-phenylene terephthalamide) (PPTA) having 5-10-fold higher values for stiffness and strength as the all-mefa linked polymers. In addition, PPTA crystallizes, whereupon the fibers achieve an extraordinary temperature resistance in a nitrogen atmosphere they decompose at temperatures above 550 °C without melting. 

Polyamides It is very difficult to incorporate additives in polyamides because of their melt reactivities. The recent developments for the flame retardancy of polyamides concern mainly the inclusion of nanoparticles, discussed in Section 24.5.3. 

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