Polishing methods techniques used

In a large number of atomic spectrometric methods sample preparation is required but depending on the method or sample introduction technique used, it can vary widely from a simple polishing step to a complete sample dissolution and subsequent analyte-matrix separation. 

To quantitatively analyze the impact of nanotopography on post-CMP oxide film thickness, we have introduced a spatial spectral method, and have used it to examine the effect of the pad type, removal depth, wafer manufacturing technique, and polishing method. However, the role of the slurry in controlling the impact of nanofopography on STI CMP is not yet clear. In this section, we discuss how the concentration of surfactant and abrasive size affect the impact of nanotopography. 

Application IBF technique has been developed for figuring high performance optics components, such as high precision optics used within the optical towers of lithography wafer steppers. Following other mechanical polishing methods, IBF is usually performed as the final step to remove the last surface errors. 

Methods making use of epoxy resins, resulting in polished sections in only a few minutes, are discussed first, followed by details of impregnation and encapsulation. Equipment and techniques for grinding and polishing, including thin-section procedures, are described. The use of Hyrax , a synthetic resin with an index of refraction of 1.70, is discussed, followed by a description of a recommended method for refractive-index determination of particles mounted on a thin film of epoxy. 

Although the dew-point method may be considered a fundamental technique for determining humidity several uncertainties occur in its use. It is not always possible to measure precisely the temperature of the polished surface or to eliminate gradients across the surface. It is also difficult to detect the appearance or disappearance of fog the usual practice is to take the dew point as the average of the temperatures when fog first appears on cooling and disappears on heating. 

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