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Passive polymers, packaging material

Applications that have received attention, and the material properties that enable them, are shown in Figure 27.1. These applications are reviewed in detail in Waser and Ramesh. Decoupling capacitors and filters on semiconductor chips, packages, and polymer substrates (e.g., embedded passives ) utilize planar or low aspect ratio oxide films. These films, with thicknesses of 0.1 to 1 J,m, are readily prepared by CSD. Because capacitance density is a key consideration, high-permittivity materials are of interest. These needs may be met by morpho-tropic phase boundary PZT materials, BST, and BTZ (BaTi03-BaZr03) solid solutions. Phase shifters (for phase array antennas) and tunable resonator and filter applications are also enabled by these materials because their effective permittivity exhibits a dependence on the direct current (DC) bias voltage, an effect called tunability. [Pg.530]


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