Pad surface temperature

FIGURE 2.7 ICIOOO pad surface temperature profiles during the polishing of 200-mm and 300-mm blanket oxide wafers using silica-based slurry under 6 psi downforce and 200 ml/min slurry flow rate and with two different table/carrier speeds (Strasbaugh n-Hance Polisher). 

FIGURE 5.10 (a) Pad surface temperature profiles during the polishing time (s) of 200 mm blanket oxide wafers using a commercially available silica-based slurry, (b) Pad surface temperature profiles during the polishing time (s) of 300 mm blanket oxide wafers using a commercially available silica-based slurry. 

Unpattemed electroplated copper wafers were polished using an IPEC 472 polisher equipped with an IR temperature sensor which measures pad surface temperature. The copper rate was determined from copper thickness measurements from a Tencor RS55 resistance monitor, calibrated to cross-sectional SEM micrographs. The SEM tools are regularly calibrated to national standards. 

Plotted with the rate is pad surface temperature (x s in Fig. 1), as measured for similar process conditions. The stark similarity of the shape of the curves adduces a strong hint as to the nature of the removal rate. Since the process conditions are not changing during this ramp, a direct causal temperature/rate relationship can clearly be inferred. 

Fig. 1. Integrated copper removal rate as a function of polish time for two positions in the film. Pad surface temperature shows similar behavior. The uniformity is also shown.

To provide channels for the removal of polishing debris and heat from the pad surface so as to reduce the possibility of scratch and generation of other defects due to the debris accumulation on the pad surface and to avoid rapid chemical reaction at localized high temperature regions due to frictional and chemical reaction heat ... 

Prasad A, Xiang H, Wang J, Remsen EE. Analysis of pre- and post-conditioned polyurethane CMP pad surfaces as, a function of conditioning temperature , 210th ECS Meeting, 2006. 

Various tool architectures have addressed the problem in different ways. Fixed platen architectures often control the temperature of the platen through a recirculated heat exchange method (Figure 1.29), and sometimes they also control the temperature of the slurry being transported to the pad surface. 

Coalescer pads ineffective temperature too hot/pH incorrect/fibers have the same charge as the droplets/surface tension negative system/wetting properties of fibers changed/fibers weathered and need to be replaced/flow rate too slow... 

Jiao, Y., Zhuang, Y., liao, X., Bomcki, L.J., Naman, A., Philipossian, A., 2012. Effect of temperature on pad surface contact area in chemical mechanical planarization. ECS Solid State Lett. 1 (2), N13—N15. http //dx.doi.Org/10.1149/2.016202ssl. 

Reflow The solder paste temperature exceeds the liquidus point and reflows, wetting both the component leads and the board pads. Surface tension effects occur, minimizing wetted volume. 

CONTOURS OF TEMPERATURE, PRESSURE AND OIL FILM THICKNESS ACROSS A TILTING THRUST PAD SURFACE. 

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