Package stacking

Y. W. Heo, A. Yoshida, R. Groover. Advances in 3-D packaging—trends and technologies for multi-chip die and package stack. VLSI Packaging Workshop of Japan, 2002. 

Several IC chips are assembled using MCM techniques and the layers are stacked similarly to package stacking. Layer-to-layer interconnects are produced using an interposer such as fuzz button layers that differentiate this approach from the... 

FIGURE 48 Drawings illustrating 3-D packaging at the top, die (or chip) slack packaging at the bottom, package stacking. 

Fast Production unit/warehouse - baled thermoplastic chips for packaging, stacked plastic products, baled clothing awaiting delivery... 

A subsidiary of lEC and Toshiba Corp. called ONSI Corp. was formed for the commercial development, production, and marketing of packaged PAEC power plants of up to 1-MW capacities. ONSI is commercially manufacturing 200-kW PAEC systems for use in a PC25 power plant. The power plants are manufactured in a highly automated faciHty, using robotic techniques to assemble the repeating electrode, bipolar separator, etc, units into the fuel cell stack. 

Golgi apparatus A system of flattened membrane-bounded vesicles often stacked into a complex. Numerous small vesicles are found peripheral to the Golgi and contain secretory material packaged by the Golgi. Involved in the packaging and processing of macromolecules for secretion and for delivery to other cellular compartments. 

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