Nucleation displacement deposition

The mechanisms of the crystal-building process of Cu on Fe and A1 substrates were studied employing transmission and scanning electron microscopy (1). These studies showed that a nucleation-coalescence growth mechanism (Section 7.10) holds for the Cu/Fe system and that a displacement deposition of Cu on Fe results in a continuous deposit. A different nucleation-growth model was observed for the Cu/Al system. Displacement deposition of Cu on A1 substrate starts with formation of isolated nuclei and clusters of Cu. This mechanism results in the development of dendritic structures. 

The book is divided into 18 chapters, presented in a logical and practical order as follows. After a brief introduction (Chapter 1) comes the discussion of ionic solutions (Chapter 2), followed by the subjects of metal surfaces (Chapter 3) and metal solution interphases (Chapter 4). Electrode potential, deposition kinetics, and thin-fihn nucleation are the themes of the next three chapters (5-7). Next come electroless and displacement-type depositions (Chapter 8 and 9), followed by the chapters dealing with the effects of additives and the science and technology of alloy deposition... 

There are four types of fundamental subjects involved in the process represented by Eq. (1.1) (1) metal-solution interface as the locus of the deposition process, (2) kinetics and mechanism of the deposition process, (3) nucleation and growth processes of the metal lattice (M a[tice), and (4) structure and properties of the deposits. The material in this book is arranged according to these four fundamental issues. We start by considering the basic components of an electrochemical cell for deposition in the first three chapters. Chapter 2 treats water and ionic solutions Chapter 3, metal and metal surfaces and Chapter 4, the metal-solution interface. In Chapter 5 we discuss the potential difference across an interface. Chapter 6 contains presentation of the kinetics and mechanisms of electrodeposition. Nucleation and growth of thin films and formation of the bulk phase are treated in Chapter 7. Electroless deposition and deposition by displacement are the subject of Chapters 8 and 9, respectively. Chapter 10 contains discussion on the effects of additives in the deposition and nucleation and growth processes. Simultaneous deposition of two or more metals, alloy deposition, is discussed in Chapter 11. The manner in which... 

In the experimental strategies to develop fully metal-based single or hetero-nanoarchitectures, one main procedure, often unintentionally employed, is represented by galvanic displacement which consists in the deposition of a solution-dispersed less active metal (a noble metal as Au, Pd, and Pt) onto a more active metal core (a less noble metal as Ag). Via red-ox permutation additional metal ions, after precipitation onto formerly nucleated metal nanoparticle. 

A chronoamperometric response at the Au tip during nanoparticle deposition was examined to demonstrate the nucleation and growth mechanism of nanoparticle deposition in the polymer film. Similarly, a galvanic displacement process was employed to enable the electroless deposition of Au nanoparticles on a copper substrate in the TG/SC mode as given by" the reaction ... 

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