NASA MSFC-SPEC

First specification to qualify die-attach adhesives (NASA MSFC-SPEC-592)... 

Id meet to qualify and assure a reliable part. This assignment, undertaken by NASA MSFC in 1974, led to the first document for the procurement of adhesives to be used in hybrid microcircuits. After further coordination and revisions, this initial document was formally released as a specification in 1978 and revised in 1982 as NASA MSFC-SPEC-592, Specification For The Selection and Use of Organic Adhesives in Hybrid Microcircuits." For the first time, the critical requirements for ionic contaminants, electrical resistivity, die-shear strength, corrosivity, and outgassing were specified. Work on the development and evaluation of adhesives continued into the mid-1980s and, as a result, several commercially available adhesives were qualified." ... 

Table 6.6 NASA MSFC SPEC-592 requirements and test methods for die- and substrate-attach adhesives... 

Electrical-stability testing is essential for conductive adhesives used for electrical connections. Electrical conductivity can degrade at elevated temperatures, on aging with or without power, and on exposiue to humidity and temperature. The specific test method used depends on the application. One test used for die-attach adhesives specified in NASA MSFC-SPEC-592 (now inactive) involves a series of gold-plated Kovar tabs attached with conductive epoxy to metal pads on an interconnect substrate. In the test vehicle, a bias of 5 V and cmrent density of 139 3.9 A7cm (900 A/in ) are applied to a series of wire-connected tabs, and the resistance change is measured after exposure to 150 °C periodically up to 1,000 horns. The maximum allowable resistance change is 5%. 

NASA MSFC-SPEC-592 has been inactivated, but this method is described in this chapter. ... 

The potential for corrosion caused by adhesives requires evaluations in both the cured and uncured state. In one test, developed for NASA MSFC-SPEC-592,1 ] the adhesive components or the cured adhesive are applied to aluminized-Mylar film and examined after 48 hours for etching or transmittance of light through the Mylar. A second test involves embedding copper wire with the adhesive and measuring corrosion by resistance changes in copper wire. Because of the wide variety oftests and the fact that they are... 

Specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits, NASA MSFC-SPEC-592, (Sep. 9,1982) (now inactivated)... 

Refractive index (ASTM D542) NASA MSFC-SPEC -592 has been inactiva ed, but this method is describee [ in this dieter. Radius of curvature (No standard mediod) ... 

The potential for corrosion caused by adhesives requires evaluations in both the cured and uncured state. In one test, developed for NASA MSFC-SPEC-5 92, the adhesive components orthe cured adhesive are applied to... 

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