Multiscale roughness

Figure 5 shows that there is no way to fit the experimental data assuming that only one type of roughness is presented on the surface. We are thus forced to conclude that, in these experiments the surface has a multiscale roughness, shown schematically in Fig. 6. The structure of this rough surface is a combination of a slight and a strong roughness shown in Fig. 3a,b. When this is taken into account, it is possible to use Eqs. 33, 34,43, and 44 to calculate the shift in resonance frequency and shift in the width of the resonance, and fit the experiments to the calculated curves with properly chosen values of the parameters of strong roughness. The result of such a fit is shown in Fig. 4, curves 2 and 3. For details of the fitting procedure, the limitations associated with the use of a simplified model, and the comparison with STM data see [27].

Fig. 6 Schematic representation of multiscale roughness. This structure is a combination of a slight and a strong roughness shown in Fig. 3a,b. (From [27])...

E. Bittoun and A. Marmur, The role of multiscale roughness in lotus effect Is it essential for super-hydrophobicity , Langmuir 28,13933-13942 (2012). 

Nosonovsky M. (2007) Multiscale roughness and stability of superhydrophobic biomimetic interfaces. Langmuir 23 3157-3161. 

McHale, G., 2007. Cassie and wenzel were they reaUy so wrong Langmuir 23, 8200. Nosonovsky, M., 2007. Multiscale roughness and stability of superhydrophobic biomimetic interfaces. Langmuir 23, 3157. 

R7.4.1 (2005). Multiscale Modeling of Two Dimensional Rough Surface Contacts. 

Multiscale Simulations, Fig. 4 Multiscale modeling of channel flow with nanoscale roughness on bottom wall, (a) Physical model abstracted from engineering application (b) streamline comparisons around one roughness the solid lines are from the hybrid modeling, the dashed line on the left is from the full MD simulation, and dashed line on the right is from the full continuum modeling (CFD)... 

In order to stress the multiscale nature of roughness, the profile function can be written as the sum of the functions that characterize the profile of the specific scale i ... 

The aluminum alloy material has roughly 11 components (as a recycled material, the alloy actually has an unknown number of components that depend on the recycling stream), and some of the concentrations are quite small. Some components have more impact than others do. Impurities can have enormous effects on the microstructure and thereby affect the properties. Precipitates form during heat treatment, and manufacturers have the opportunity to optimize the aluminum heat treatment to achieve an optimized structure. First principles calculations and multiscale calculations are able to elucidate opportunities, including overturning 100 years of metallurgical conventional wisdom (Figure 4). ... 

Electrodes where charge transfer occurs via a diffusion controlled adsorption step, has a characteristic adsorption distance La = (9F/dC)E near electrode, it represents the extent to which an electroactive species is adsorbed on the surface from the volume to create surface excess (F). Surfaces with large La causes enhanced rate of reaction due to onset of superdiffusive behavior in high frequency or short time which crosses over to intermediate adsorption kinetics controlled subdiffusion in multiscale nanostructures or rough electrodes [22], The intermediate crossover frequency between super-and sub- diffusion is con While at lower frequency coAd D / L, response cross over to adsorption capacitance. 

Electrodeposition of copper on trenches of microchip interconnects is an important process in modern microelectronics. Thus, KMC models ° and KMC-based multiscale models ° ° have been used to investigate the nucle-ation, surface chemistry, and roughness evolution in this process. However, most KMC models of electrodeposition have not incorporated electrochemical influences and so will not be discussed here. Nonetheless, due to the success of KMC with other electrochemical systems, excellent future opportunities exist for applying KMC to electrodeposition processes. 

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