Multiscale rough surfaces

R7.4.1 (2005). Multiscale Modeling of Two Dimensional Rough Surface Contacts. 

Figure 5 shows that there is no way to fit the experimental data assuming that only one type of roughness is presented on the surface. We are thus forced to conclude that, in these experiments the surface has a multiscale roughness, shown schematically in Fig. 6. The structure of this rough surface is a combination of a slight and a strong roughness shown in Fig. 3a,b. When this is taken into account, it is possible to use Eqs. 33, 34,43, and 44 to calculate the shift in resonance frequency and shift in the width of the resonance, and fit the experiments to the calculated curves with properly chosen values of the parameters of strong roughness. The result of such a fit is shown in Fig. 4, curves 2 and 3. For details of the fitting procedure, the limitations associated with the use of a simplified model, and the comparison with STM data see [27].

Electrodes where charge transfer occurs via a diffusion controlled adsorption step, has a characteristic adsorption distance La = (9F/dC)E near electrode, it represents the extent to which an electroactive species is adsorbed on the surface from the volume to create surface excess (F). Surfaces with large La causes enhanced rate of reaction due to onset of superdiffusive behavior in high frequency or short time which crosses over to intermediate adsorption kinetics controlled subdiffusion in multiscale nanostructures or rough electrodes [22], The intermediate crossover frequency between super-and sub- diffusion is con While at lower frequency coAd D / L, response cross over to adsorption capacitance. 

Electrodeposition of copper on trenches of microchip interconnects is an important process in modern microelectronics. Thus, KMC models ° and KMC-based multiscale models ° ° have been used to investigate the nucle-ation, surface chemistry, and roughness evolution in this process. However, most KMC models of electrodeposition have not incorporated electrochemical influences and so will not be discussed here. Nonetheless, due to the success of KMC with other electrochemical systems, excellent future opportunities exist for applying KMC to electrodeposition processes. 

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