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Multicolor photolithography

The two most commonly used approaches to fabricating buried channel waveguides are reactive ion etching (RIE) and multicolor photolithography (photochemical etching) [12]. [Pg.640]

Schematic of scanning multicolor photolithography for fabricating tapered... Schematic of scanning multicolor photolithography for fabricating tapered...
FIGURE 28 Experimental production of a tapered index of refraction profile using scanning multicolor photolithography. [Pg.648]

Figure 11.9. NW LED. (a) Crossed InP nanowire LED. (top) Three-dimensional (3D) plot of light intensity of the electroluminescence from a crossed NW LED. Light is only observed around the crossing region, (bottom) 3D atomic force microscope image of a crossed NW LED. (inset) Photoluminescence image of a crossed NW junction, (b-c) Multicolor nanoLED array, (b) Schematic of a tricolor nanoLED array assembled by crossing one n-GaN, n-CdS, and n-CdS NW with a p-Si NW. The array was obtained by fluidic assembly and photolithography with ca. 5- xm separation between NW emitters, (c) Normalized EL spectra obtained from the three elements. [Reprinted with permission from Ref. 59. Copyright 2005 Wiley-VCH Verlag.]... Figure 11.9. NW LED. (a) Crossed InP nanowire LED. (top) Three-dimensional (3D) plot of light intensity of the electroluminescence from a crossed NW LED. Light is only observed around the crossing region, (bottom) 3D atomic force microscope image of a crossed NW LED. (inset) Photoluminescence image of a crossed NW junction, (b-c) Multicolor nanoLED array, (b) Schematic of a tricolor nanoLED array assembled by crossing one n-GaN, n-CdS, and n-CdS NW with a p-Si NW. The array was obtained by fluidic assembly and photolithography with ca. 5- xm separation between NW emitters, (c) Normalized EL spectra obtained from the three elements. [Reprinted with permission from Ref. 59. Copyright 2005 Wiley-VCH Verlag.]...
Multianalyte detection in a single sample has been reported extensively using electrochemical, piezoelectric, electrical resistance, - and oph-capo 11,33 39 methods. The sensor arrays were fabricated by photolithography and soft lithography, - inkjet-, screen-, and pin-prinhng, - and photodeposition.i 34,i4,45 jhese techniques involve labor-intensive multistep fabrication and image analysis and pattern-recognihon codes. The monochromatic or multicolor OLED excitation platform in (micro)arrays would drastically simplify fabrication and reduce cost. [Pg.530]


See other pages where Multicolor photolithography is mentioned: [Pg.643]    [Pg.645]    [Pg.653]    [Pg.114]    [Pg.643]    [Pg.645]    [Pg.653]    [Pg.114]   
See also in sourсe #XX -- [ Pg.644 , Pg.648 ]




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