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Multichip Packages Chip Scale Packaging

In the multichip package, a variety of pretested chips (e.g., bipolar, MOS, and GaAs) and discrete components (decoupling capacitors and termination resistors) may be mounted on the high-density interconnection substrate. This approach is sometimes termed hybrid-wafer-scale integra-... [Pg.480]

Inabihty to see hidden solder joints in component types such as some connectors, PGAs, EGAs, chip-scale packages (CSPs), SIPs, or multichip modules (MCM)... [Pg.1253]

See other pages where Multichip Packages Chip Scale Packaging is mentioned: [Pg.339]    [Pg.601]    [Pg.187]    [Pg.187]    [Pg.187]    [Pg.259]    [Pg.1345]    [Pg.1281]   
See also in sourсe #XX -- [ Pg.4 , Pg.4 , Pg.7 , Pg.8 ]



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Chip Scale Packaging

Multichip

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