Mitsubishi Electronic Corporation

Present address Manufacturing Engineering Center, Mitsubishi Electronic Corporation, 8-1-1 Tsukaguchi-honmachi, Amagasaki, Hyogo 661-8661, Japan. 

Examples of applied structural adhesive bonding in various machine structures are in the construction of the elevator and box applications of the Mitsubishi Electronic Corporation. The high bonding strength and ease of use of SGA (second generation acrylic resin adhesive) result in weight reduction and excellent architectural and structural beauty. 

Toshiyuki Ishikawa, Masayo Sato, Yuko Itoh, Hrroki (Research Center, Mitsubishi Chemical Corporation, Yokohama, Japan). J. Photopolym. Sci. Technol. (1999), 12 (5), 711-716. Quenching of imidazoyl radical (Im ) produced in 2-[p-(diethyl-amino)styryl]naphtho[l, 2-d]thiazole (NAS) sensitized photolysis of 2,2 -bis(2-chlorophenyl)-4,4, 5,5Gtetraphenyl-l,l -bi-lH-imidazole (BI) in PMMA film in the presence of 2-mercapto-benzothiazole (MBT) was studied by laser flash photolysis using a total reflection cell. It was obsd. that MBT acted as an accelerator increasing the initial concn. of Im by slowing down the back electron-transfer from BI anion to NASA cation, and also quenched Im radical by hydrogen transfer. 

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