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Microvia fabrication Laser

However, a greater emphasis will be placed on the laser-drilling process laser via hereafter) since it is the most popular process today and it seems its popularity will grow in the future. It must be understood that via hole formation is just one element of fabricating HDI wiring boards. Fabrication of HDI wiring boards with microvia holes involves many new processes not common to conventional board fabrication. Therefore, additional emphasis will be placed upon these new fabrication processes that are common to other microvia technologies. [Pg.472]

One important step in microvia hole board fabrication when resin is the dielectric choice, whether the process is photovia or laser via, is the removal of residual catalysts (normally palladium) entrapped in a microporous surface that can cause migration.The process used in this step is normally a trade secret. [Pg.495]

See other pages where Microvia fabrication Laser is mentioned: [Pg.483]    [Pg.488]    [Pg.490]    [Pg.501]    [Pg.505]    [Pg.147]   
See also in sourсe #XX -- [ Pg.7 , Pg.8 , Pg.9 , Pg.10 , Pg.11 , Pg.12 , Pg.13 , Pg.14 , Pg.15 , Pg.16 , Pg.17 , Pg.18 , Pg.19 , Pg.20 , Pg.21 , Pg.22 , Pg.22 , Pg.22 , Pg.23 , Pg.33 ]



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Microvia

Microvia fabrication

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