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Microstructure coarsening

Microstructural characteristics of spinodal decomposition are periodicity and alignment. Periodicity arises from wavelengths associated with the fastest-growing initial mode. At later times, the characteristic periodic length increases due to microstructural coarsening. Periodicity can be detected by diffraction experiments. [Pg.450]

In the final stage, densification is very slow because of the large diffusion distances and the rigid skeleton of contacting solid grains. Microstructural coarsening by the... [Pg.97]

Microstructural coarsening occurs with slow solid-state sintering of the solid. [Pg.433]

I. Dutta, A Constitutive Model for Creep of Lead-Free Solders Undergoing Strain-Enhanced Microstructural Coarsening A Eirst Report, J. Electron. Mater., 2002... [Pg.196]

Microstructural coarsening within ZTA produces a fracture toughness increment, mainly associated with the effect of zirconia particle phase transformability. [Pg.101]

Several binary eutectic or near-eutectic alloys have been suggested as replacements for eutectic Sn-Pb, among them are Sn-Bi, Sn-In, and Sn-Ag, which have all been utilized in electronics applications [15-17]. However, the Sn-Ag system has a limited solubility of Ag in Sn, making it more resistant to microstructural coarsening, and the AgsSn precipitate is uniformly distributed, resulting in an overall structure that has the attributes of being more reliable [18,19]. [Pg.241]

FIG. 1 Light photo micrographs depicting microstructural coarsening of the eutectic Sn-Ag solders, where the dark phase is Sn and white particles are Ag3Sn. (a) Before aging, (b) after aging at 150° C for 100 hr. (From Ref. 4.)... [Pg.314]

Gibson, A.W. Choi, S.L. Subramanian, K.N. Bieler, T.R. Issues regarding microstructural coarsening due to aging of eutectic tin-silver solder. Design Reliability of Solders and Solder Interconnections—Proceedings of Minerals, Metals Materials Society (TMS) Symposium, Orlando, FL, 1997 97-103. [Pg.328]

See other pages where Microstructure coarsening is mentioned: [Pg.264]    [Pg.119]    [Pg.442]    [Pg.235]    [Pg.15]    [Pg.222]    [Pg.316]    [Pg.586]    [Pg.663]    [Pg.665]    [Pg.803]    [Pg.282]    [Pg.1333]    [Pg.154]    [Pg.67]    [Pg.691]    [Pg.123]    [Pg.512]    [Pg.442]    [Pg.91]    [Pg.96]    [Pg.225]    [Pg.243]   
See also in sourсe #XX -- [ Pg.2 , Pg.2 , Pg.3 , Pg.3 , Pg.4 , Pg.5 , Pg.5 , Pg.17 , Pg.17 ]

See also in sourсe #XX -- [ Pg.2 , Pg.2 , Pg.3 , Pg.3 , Pg.4 , Pg.5 , Pg.5 , Pg.17 , Pg.17 , Pg.18 ]

See also in sourсe #XX -- [ Pg.352 , Pg.356 , Pg.361 ]



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