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Microdevices fabrication

Snyder GJ, Lim JR, Huang CK, Fleurial JP (2003) Thermoelectric microdevice fabricated by a MEMS-tike electrochemical process. Nat Mater 2 528-531... [Pg.226]

Microdevice Fabrication, Sample Preparation and Data Acquisition... [Pg.155]

MICRODEVICES FABRICATION FOR MICROELECTROMECHANICAL SYSTEMS AND OTHER MICROENGINEERING APPLICATIONS... [Pg.185]

Microdevices fabrication for MEMS and other microengineering applications have been reported in Chapter 10. It presents a clear view on fabrication of microfeature of aluminum, copper, stainless steel, nickel, and titanium, etc., for MEMS. Some of the interesting topics included in this chapter are fabrication of high aspect ratio features for MEMS as well as micromachining of semiconductor by EMM. Here, EMM has successfully demonstrated its capabifity as an alternative technique for machining of microdevices with three-dimensional features of higher resolutions on metals as well as semiconductors. [Pg.278]

Representative results of microdevices fabricated with hot embossing are illustrated in Fig. 9. An SEM of a microchaimel array of a flow cytometry system embossed in PC using an RIE-etched silicon master [17] is illustrated in Fig. 9a. Small micrometer-sized channels... [Pg.2112]

See other pages where Microdevices fabrication is mentioned: [Pg.101]    [Pg.344]    [Pg.1157]    [Pg.1171]    [Pg.1423]    [Pg.194]    [Pg.196]    [Pg.198]    [Pg.200]    [Pg.202]    [Pg.204]    [Pg.349]    [Pg.361]    [Pg.365]    [Pg.3]    [Pg.611]    [Pg.226]    [Pg.1265]    [Pg.110]    [Pg.212]   
See also in sourсe #XX -- [ Pg.4 , Pg.5 , Pg.6 ]

See also in sourсe #XX -- [ Pg.185 ]



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