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Fabrication of Microdevices Using CMP

Microelectronic Applications of Chemical Mechanical Planarization, Edited by Yushuo Li Copyright 2008 John Wiley Sons, Inc. [Pg.401]

Microfabrication has emerged from microelectronics manufacturing and is using its proven processes and process sequences. Additionally, specific methods have been developed to fabricate mechanical, electrical, optical, or sensor structures, which are characteristics of microfabrication. In order to stay within the scope of this book, only top-down methods, that is, the manufacture of smaller structures with higher functionality from larger structures by the use of subtractive methods, will be discussed. Bottom-up methods, which create larger structures by ordered arrangement of small units (molecules, nanoparticles), are still in their infancy and mainly employed for biosensors. [Pg.402]

Three top-down manufacturing methods are currently used in micro-fabrication  [Pg.402]


Zwicker, G., 2008. Fabrication of microdevices using CMP. In li, Y. (Ed.), Microelectronic Applications of Chemical Mechanical Planarization. Wiley Intersdence, Hoboken, pp. 401-429. [Pg.485]


See other pages where Fabrication of Microdevices Using CMP is mentioned: [Pg.401]    [Pg.402]    [Pg.404]    [Pg.408]    [Pg.410]    [Pg.412]    [Pg.416]    [Pg.418]    [Pg.420]    [Pg.422]    [Pg.424]    [Pg.426]    [Pg.428]    [Pg.401]    [Pg.402]    [Pg.404]    [Pg.408]    [Pg.410]    [Pg.412]    [Pg.416]    [Pg.418]    [Pg.420]    [Pg.422]    [Pg.424]    [Pg.426]    [Pg.428]    [Pg.401]    [Pg.3]    [Pg.222]   


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