Metallization using glass-metal mixtures

Heating at the normal metallizing temperature of 1400°C in H2 or N2-H2 environments dissociates the oxide films on Mo surfaces, but the resultant formation of H20 causes the environment to become damp. Similarly, Mn02 is reduced, or Mn is oxidised, to MnO by environments with a H20/H2 ratio of between 4.3xlO-4 and 2.67. (While this ratio is of chemical significance, it is monitored in practice by measurement of a physical parameter, the Dew Point or 

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Metal powder—glass powder—binder mixtures are used to apply conductive (or resistive) coatings to ceramics or metals, especially for printed circuits and electronics parts on ceramic substrates, such as multichip modules. Multiple layers of aluminum nitride [24304-00-5] AIN, or aluminay ceramic are fused with copper sheet and other metals in powdered form. The mixtures are appHed as a paste, paint, or slurry, then fired to fuse the metal and glass to the surface while burning off the binder. Copper, palladium, gold, silver, and many alloys are commonly used. 

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