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Medical adhesives strength tests

Mechanical attachment of components, devices, and other parts of an electronic assembly is the prime function of adhesives. Although adhesives are expected to bond a wide variety of materials for electronic applications, they do not need to be structural. They should, however, meet minimum tensile and shear strengths in order to withstand mechanical shock, thermal shock, thermal cycling, and vibration as specified for the intended application. For consumer and commercial products, these stresses may be minimal. For high reliability aerospace and medical systems, more severe tests as defined in MIL-STD-883 and other documents must be used. [Pg.36]


See other pages where Medical adhesives strength tests is mentioned: [Pg.69]    [Pg.322]    [Pg.172]    [Pg.228]    [Pg.361]    [Pg.44]    [Pg.47]    [Pg.125]    [Pg.231]    [Pg.774]   
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