Materials processing properties

J. R. Groza 2002, in Nanostructured Materials - Processing, Properties and Potential Applications, ed. C. C. Koch, William Andrew Publishing, New York, chap. 4. 

Rogers, J. A. Baldwin, K. Bao, Z. Dodabalapur, A. Raju, V. R. Ewing, J. Amundson, K. 2001. Rubber stamped plastic circuits for electronic paper. Proceedings—International Symposium on Advanced Packaging Materials Processes, Properties, and Interfaces, pp. 98-103. 

Goodby JW, Bates M, Saez IM, Gorecka E, Kitzerow HS, Guillon D, Donnio B, Serrano JL, Deschenaux R (2009) Polymer-based smart materials - processes, properties and application 1134 261... 

Hayes, D. J., et al., Development and Application by Ink Jet Printing of Advanced Packaging Materials, in Proceedings of the International Symposium on Advanced Materials Process, Properties and Interfaces, 1999, pp. 88-92. 

Windlass, H., Raj, P.M., Balaraman, D., Bhattacharya, S.K., and Tummala, R.R., Colloidal processing of polymer ceramic nanocomposites for integral capacitors, in Proceedings of the International Symposium on Advanced Packing Materials Processes, Properties, and Interfaces, IEEE, Piscataway, NJ, 2001. 

Shi DM, McKeen K, Jensen B. Advances in flip-chip cure rates and reliahility. In Proc. Fourth Int. Symp. and Exhibition on Advanced Packaging Materials, Processes. Properties, and Interfaces. Braselton, GA IMAPS Mar. 1998. 

Markley, P. L., Tong, Q. K., Magliacca, D. J., andHahn, T. P., Characterization of Silver Flakes Utilized for Isotropic Conductive Adhesives, Proc. IMAPS, Inti. Symp. On Advanced Packaging, Materials, Processes, Properties, and Interfaces,pp. 16-20(1999)... 

Boch P, Niepce JC, editors. Ceramic materials processes, properties, and applications. John Wiley Sons, Inc. 2007. 

Nanostructured Materials. Processing, Properties, and Applications. Edited by Carl, C., Koch. NY William Andrew Publishing, 752. 

Hongjin J, Kyoung-sik M, Wong C.R Synthesis of Ag-Cu alloy nanoparticles for leadfree interconnect materials, advanced packaging materials processes, properties and interfaces. Rroceed-ings International Symposium 2005, p. 173-177, 16-18 March. 

H. Takezawa, M. Itagaki, T. Mitani, Y. Bessho, and K. Eda, in Proceedings of 4th International Symposium and Exhibition on Advanced Packaging Materials, Processes, Properties and Interfaces, Braselton, Ga., Mar. 1999, pp. 11-15. 

Ishida, M., Hasegawa, T., Iwaida, T., and Knudsen, A., Aluminum Nitride Packaging, Proceedings. International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, 14-17 Mar 1999, pp. 133-135, Braselton, GA, USA. 

P. Boch, J.-C. Niepce, A. Bouquillon, Ceramic Materials Processes, Properties and Applications (Wiley, New York, 2010)... 

Erb U., Aust K. T. and Palumbo G. (2002), Electrodeposited nanocrystalline materials , in Koch C. C. (Ed.), Nanostructured materials processing, properties and potential applications. Norwich, NY William Andrew Pubhshing, p. 179. 

Suryanarayana C. and Koch C. C. (2000), NanocrystaUine Materials-Current Research and Future DirectioDs, Hyperfine Interactions, 130, 5 14. (doi 10.1023/a 1011026900989) Suryanarayana C. and Prabhu B. (2007), Synthesis of Nanostructured Materials by Inert-Gas CondsasatiouMsthods in Nanostructured Materials Processing, Properties, and Applications, Second Edition, Koch C. C. (Ed.). Norwich WiUiam Andrew, Inc., pp. 47-90. 

Sources of Information Aggarwal et al. (2010) is an extensive survey of materials, processing, properties, and applications. Other sources of information are provided in Section 3.4.5. 

Ceramic materials processes, properties and applications/edited by Philippe Boch, Jean-Claude Niepce, p. cm. 

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