Material removal rate factors

Oxidizer concentration is also one of the important factors in determining material removal rate, and it was found to increase with the oxidizer concentration [43,106]. With the increase of oxidizer concentration, both Wa and Ra decrease at first and then increase, the optimum concentration is 1 wt %, and relative low oxidizer concentration helps to get lower Wa and Ra values as shown in Figs. 36(a) and 36(b). High concentration of oxidizer may result in excessive corrosive wear, which will lead to the increasing of topographical variations. 

The characteristics of CMP are material removal rate (MRR), thickness uniformity, and surface quality, and they are directly related to device characteristics and productivity. These characteristics are determined by each factor as per Figure 1.3. 

This chapter provides experimental data for the magnetic head material removal rate and surface finish. These two parameters were considered as the important factors for the magnetic head manufacturer as it reflects the needs of the customers. In this step, where we super polish the magnetic heads, we are trying to obtain a direct relationship between slurry type and material removal rate. Other characteristics to be included are particle size, concentration, and amoimt more parameters will be included in future experiments. 

In heterogeneous catalysis reactants have to be transported to the catalyst and (if the catalyst is a porous, solid particle) also through the pores of the particle to the active material. In this case all kinds of transport resistance s may play a role, which prevent the catalyst from being fully effective in its industrial application. Furthermore, because appreciable heat effects accompany most reactions, heat has to be removed from the particle or supplied to it in order to keep it in the appropriate temperature range (where the catalyst is really fully effective). Furthermore, heterogeneous catalysis is one of the most complex branches of chemical kinetics. Rarely do we know the compositions, properties or concentrations of the reaction intermediates that exist on the surfaces covered with the catalytically effective material. TTie chemical factors that govern reaction rates under these conditions are less well known than in homogeneous catalysis. Yet solid catalysts display specificities for particular reactions, and selectivity s for desired products, that in most practical cases cannot be equaled in other ways. Thus use of solid catalysts and the proper (mathematical) tools to describe their performance are essential. 

There is a competition between dissolution of the mechanical abraded material in the slurry and redeposition back on the abraded surface. Derive an expression for the removal rate of copper as a function of the polish parameters, solubility of Cu or passivated Cu in die slurry, and the redeposition factor. 

The primary metrics of success for a CMP process are (1) the MRR and (2) the post-CMP defect density. But even the removal rate is made up of a complex of other factors, which have mechanisms operating from the nanoscale to the macroscale. A nanotribology view of the process would observe the individual abrasive particles in their interactions, sandwiched between the pliable pad and the exposed wafer surface. If we were to zoom out our viewpoint one order of magnitude or two, we would encounter the variations in wafer surface features (both physical dimensions and material variations) that constitute the elements of the IC device components, such as interconnect lines. 

The most common factor in fretting is oxidation. In oxidizing systems, fine metal particles removed by adhesive wear are oxidized and trapped between the fretting surfaces. The oxides act like abrasives and increase the rate of material removal. The red... 

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