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Loctite underfill adhesives

Underfill adhesive (rapid cure) 30-60% Bisphenol F epoxy reaction product, 15% imidazole catalyst, 30-60% silica filler Loctite 3563 (Henkel)... [Pg.119]

Underfill adhesive (snap cure) Epoxy resins (high purity Bisphenol-A and cycloaliphatic resins) 45-60% Resin modifier 1—5% Curing agents (amine) 3-5% Filler (amorphous silica) 50-80% Loctite 3563, Ablebond 7811... [Pg.140]

Champion 3000/ Creative Automation 18 X 18 1.5 True Volume Pump / 90,000 (maximum) Underfill, encapsulation. Dam Fill, conductive epoxy, SMA and solder paste SMT Adhesives Loctite Chipbonder 3615 (red), Dymax 9-20365 (red) and 20366 (yellow). [Pg.234]

MicroMax / GPD Global 12 X 12 2.25 True Value Pump/ servo-driven valve/36,000 SMT adhesive, conductive epoxies, no-flow underflll (unheated), hybrid assembly, small-dot dispensing SMT Adhesives Amicon D125F, 125FDR, Loctite Chipbonder 3615 (red), Dymax 9-20367 (red) and 9-20368 (yeUow), Amicon E7650, 7652, conductive epoxies Ablebond 84-1 LMl, no-flow underfill Amicon E1330 LV, 1350, and 1355. [Pg.235]

See other pages where Loctite underfill adhesives is mentioned: [Pg.232]    [Pg.301]    [Pg.232]    [Pg.303]   
See also in sourсe #XX -- [ Pg.232 ]



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