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Linear oxidation, silicon

Thus, <100> surfaces oxidize more slowly than <111> surfaces do. The lower oxidation rate of <100> surfaces is due probably to the fewer sites with which oxygen can react. B/A depends on the number of silicon bonds per cubic centimeter available. The linear oxidation rate for various forms of Si follows the sequence <110> > <111> > <311> > <511> > <100> (105). A crossover in rate such that the rate for <111> Si is greater than that for <110> Si occurs at 700 and 1000 °C but not at 1100 °C. [Pg.327]

Another approach in generating molecular insulating layers without the need of chemical conversion after deposition is the use of preliminarily modified molecules which can form dense self-assembled monolayers. To create dense self-assembled monolayers with sufficient robustness and insulating properties, a modified alkyltrichlorosilane with an aromatic end-group (18-phenoxyoctadecyl)tri-chlorosilane (PhO-OTS chemical structure Fig. 6.15a) was synthesized and tested [50]. The SAMs were created in a one-step process from vapor phase or solution. On self-assembly on a natively oxidized silicon surface the n-n interaction between the phenoxy end-groups of adjacent molecules creates an intermolecular top-link, leading to a more closely packed surface compared to monolayer than when linear end groups are used. [Pg.155]

FIG. 5 Particle mobility profile (from plate to plate) between two thermally oxidized silicon wafers in I mM NaCI at various locations from the sidewall 0.1 mm ( ). 0.4 mm (O), 0.902 mm ( ). and 2.5 mm (A). Drawn lines correspond to a linear least squares curve tit to the hydrodynamic equations describing fluid flow between the plates. [Pg.124]

Under O2-RIE, contrary to the O2-IBE, etching depth does not linearly increase with etching time, as is typically shown in Fig. 3. Etching begins with a relatively high rate and the rate slows down towards the end with a steady state. This is mainly because, at an initial stage, atoms other than silicon are consumed by oxygen radical species, until the oxidized silicon protection layer is... [Pg.361]

Thermal oxidation of silicon can be achieved under dry or wet oxidation condition. In dry oxidation, oxygen is the oxidant whereas in wet oxidation, water molecule is the oxidant. Thermal oxidation is often carried out at elevated temperatures, such as 600-1250°C. The oxide growth rate is generally faster in wet oxidation compared to dry oxidation. Also, the growth rate of the oxide depends on the crystallographic orientation of the silicon, that is, the linear oxidation rate of silicon qualitatively is [110] > [111] > z[100]. However, crossover in growth rate is possible for instance, the oxide growth rate at 700-1000°C, [111] > [110], but not at 1100°C. [Pg.1628]

Silicone polyethers are non-ionic in nature, and have both a hydrophilic part (low molecular weight polymer of ethylene oxide or propylene oxide or both) and a hydrophobic part (the methylated siloxane moiety). The polyether groups are either ethylene oxide or propylene oxide, and are attached to a side chain of the siloxane backbone through a hydrosilylation or condensation process. They can form a rake-like, comb structure, or linear structure. Silicone polyethers are stable up to 160-180 degrees Celsius. There is a great degree of flexibility in designing these types of polymers. A very wide variety of co-polymers is possible when the two chemistries are combined. [Pg.79]

Figure 20.6. The friction-load relationship for an 18 pm sphere of cellulose in contact with a silanated, oxidized silicon wafer (98). Data from both loading and unloading is shown. The continuous line is a fit relating the frictional force linearly to the area of contact, assuming that the load-area relationship is described by the DMT theory... Figure 20.6. The friction-load relationship for an 18 pm sphere of cellulose in contact with a silanated, oxidized silicon wafer (98). Data from both loading and unloading is shown. The continuous line is a fit relating the frictional force linearly to the area of contact, assuming that the load-area relationship is described by the DMT theory...
Recently, silicon-tethered diastereoselective ISOC reactions have been reported, in which effective control of remote acyclic asymmetry can be achieved (Eq. 8.91).144 Whereas ISOC occur stereoselectively, INOC proceeds with significantly lower levels of diastereoselection. The reaction pathways presented in Scheme 8.28 suggest a plausible hypo thesis for the observed difference of stereocontrol. The enhanced selectivity in reactions of silyl nitronates may he due to 1,3-allylie strain. The near-linear geometry of nitrile oxides precludes such differentiating elements (Scheme 8.28). [Pg.273]

Electropolishing region does not occur in anhydrous organic solutions due to the lack of water which is required for the formation of oxide film. Figure 5, as an example, shows that in anhydrous HF-MeCN solution the current can increase with potential to a value of about 0.5 A/cm2 without showing a peak current. The relationship between current and potential is linear due to the rate limiting effect of resistance in solution and silicon substrate. [Pg.154]

Silicones possess both thermal stability and good mechanical, chemical, and electric properties between —70 and 250 C. In the absence of oxygen, many linear siloxanes degrade at temperatures greater than 350 C to give cyclic products. Oxidative degradation generally occurs at lower temperatures. [Pg.180]

Fig. 13.20. Optical heterodyne force microscopy (OHFM) and its application to a copper strip of width 500 nm, thickness 350 nm, on a silicon substrate, with subsequent chemical vapour deposition (CVD) of a silicon oxide layer followed by polishing and evaporation of a chromium layer of uniform thickness 100 nm and flatness better than 10 nm (a) amplitude (b) phase 2.5 [im x 2.5 m. Ultrasonic vibration at fi = 4.190 MHz was applied to the cantilever light of wavelength 830 nm was chopped at fo = 4.193 MHz and focused through the tip to a spot of diameter 2 im with incident mean power 0.5 mW the cantilever resonant frequency was 38 kHz. The non-linear tip-sample interaction generates vibrations of the cantilever at the difference frequency f2 — f = 3 kHz (Tomoda et al. 2003). Fig. 13.20. Optical heterodyne force microscopy (OHFM) and its application to a copper strip of width 500 nm, thickness 350 nm, on a silicon substrate, with subsequent chemical vapour deposition (CVD) of a silicon oxide layer followed by polishing and evaporation of a chromium layer of uniform thickness 100 nm and flatness better than 10 nm (a) amplitude (b) phase 2.5 [im x 2.5 m. Ultrasonic vibration at fi = 4.190 MHz was applied to the cantilever light of wavelength 830 nm was chopped at fo = 4.193 MHz and focused through the tip to a spot of diameter 2 im with incident mean power 0.5 mW the cantilever resonant frequency was 38 kHz. The non-linear tip-sample interaction generates vibrations of the cantilever at the difference frequency f2 — f = 3 kHz (Tomoda et al. 2003).
Silicon-based dendrimers 8 and 9 (Fc = ferrocenyl) also showed oxidative precipitation onto electrodes to give idealized electrochemistry as films.181 Specifically, the peak current was linear with scan rate and the potential difference between the anodic and cathodic waves was small (AE = 10 mV at a scan rate of 100 mV/s).182 This latter observation indicated that the rate of electron transfer was rapid. For molecule 9, the surface coverage was measured as = 2 x 10 10 mol/cm2. These molecules were also explored as mediators in amperometric biosensors.183 In contrast, molecule 10 showed two redox peaks, indicative of interaction between the two ferrocenyl units at each peripheral site. 181 When oxidation of one of the two interacting redox units results in some electron sharing between the two units (Robin-Day class II mixed valence species), the second oxidation is naturally... [Pg.108]


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See also in sourсe #XX -- [ Pg.338 ]




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Oxidation silicones

Oxides silicon oxide

Oxidized silicon

Silicon oxidation

Silicon oxides

Silicones, linear

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