Lead-free ceramic chip components

The solder balls for area array components (e.g., ceramic ball grid arrays—CBGAs plastic ball grid arrays—PBGAs chip scale packages—CSPs) do have, of course, a processing-related cost that will not have as much effect in blurring the cost differential between lead and lead-free solders as occurs with solder pastes. Like solder bars, the cost of solder will likely track more closely with the raw material cost. 

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