Japan Electronics and Information Technology Industries Association

Among the various lead-free solder alloys, the National Electronics Manufacturing Initiative (NEMI) recommends Sn-3.9Ag-0.6Cu ( 0.2%) for reflow soldering (Ref 1), while JEITA (Japan Electronics and Information Technology Industries Association) recommends Sn-3.0Ag-0.5Cu. Under most typical use conditions, Sn-Ag-Cu (SAC) alloy in general exhibits a greater resistance to creep as compared to Pb-Sn alloy and hence creeps 10 to 100 times slower (Ref 2). The microstructure, the plastic and creep behavior, and the failure mechanism in Sn-Ag-Cu solder are vastly different compared to Pb-Sn solder, and therefore, it is important to develop appropriate thermomechanical predictive models for Sn-Ag-Cu solder. 

JEITA Japan Electronics and Information Technology Industries Association XRF x-ray fluorescence... 

While an increasing number of environmentally friendly products continue to be introduced in Japan and Europe, some North American companies have taken a wait and see approach while others are pacing themselves based on market demands and supply line availability to the lead-free issue. Many Japanese companies have adopted the use of lead-free solder and lead-free components. The use of green labels helps to promote lead-free product introduction using guidelines established by the Japan Electronics and Information Technology Industries Association (JEITA). 

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