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Japan Electronic Industry Development Association

Among the various lead-free solder alloys, the National Electronics Manufacturing Initiative (NEMI) recommends Sn-3.9Ag-0.6Cu ( 0.2%) for reflow soldering (Ref 1), while JEITA (Japan Electronics and Information Technology Industries Association) recommends Sn-3.0Ag-0.5Cu. Under most typical use conditions, Sn-Ag-Cu (SAC) alloy in general exhibits a greater resistance to creep as compared to Pb-Sn alloy and hence creeps 10 to 100 times slower (Ref 2). The microstructure, the plastic and creep behavior, and the failure mechanism in Sn-Ag-Cu solder are vastly different compared to Pb-Sn solder, and therefore, it is important to develop appropriate thermomechanical predictive models for Sn-Ag-Cu solder. [Pg.181]

See other pages where Japan Electronic Industry Development Association is mentioned: [Pg.84]    [Pg.84]    [Pg.665]    [Pg.687]    [Pg.19]    [Pg.326]    [Pg.580]    [Pg.2660]    [Pg.373]    [Pg.18]    [Pg.460]    [Pg.335]    [Pg.2]    [Pg.7]    [Pg.156]   
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Electron developments

Electronic Development

Electronics industry

Industrial electronics

Industry associations

Japan Electronic Industry Association

Japan Electronic Industry Development

Japan Electronics Development

Japan development

Japan industry

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