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Interface control engineering

By delivering slurry directly to the pad-wafer interface, process engineers have a great deal of latitude in controlling slurry distribution across the wafer during polish. In other words, they can design processes that do not suffer the limitations of pH or oxidizer concentration gradients across the wafer. Oxide and metal CMP processes are very different, so it is useful not only to be able to inject slurry directly to the wafer surface, but also to control where on the wafer the slurry is delivered. [Pg.25]

Rosato DV, Rosato MG, Rosato DV (2000) Concise encyclopedia of plastics. Kluwer, Boston, MA Rudin A (1999) Elements of polymer science and engineering. Elsevier, Amsterdam Rlihle M, Gleiter H (eds) (2000) Interface controlled materials. Wiley, Weinheim Schwartz M (2002) Encyclopedia of materials, parts and finishes. CRC, Boca Raton, FL Schweitzer PA (2006) Paint and coatings applications and corrosion resistance. Taylor and Francis, London... [Pg.17]

Guide 2002. A Guide to Design, Operational and Human Interface Issues. Process Plant Control Desks Utilizing Human Computer Interfaces. The Engineering Equipment and Materials Users Association — Publication No 201. [Pg.315]

Johannsen G., Borys B.B., Fejes L. Ergonomic Knowledge suppcMt in grsqihical interface design for industrial process operators. Proc. 2nd Symposium on Human Intaface, pp 579-584, Tokyo, Society of Instrument and Control Engineers, 1986. [Pg.238]

Spalazzi JP, Doty SB, Moffat KL, Levine WN and Lu HH. Development of controlled matrix heterogeneity on a triphasic scaffold for orthopedic interface tissue engineering. Tissue Eng. 2006 12 3497-3508. [Pg.639]

D. K. Zondervan and D. J. Reinkensmeyer, "Kinect-Wheelchair Interface Controlled (KWIC) Robotic Trainer for Powered Mobility, Demo Competition Abstract," in 34fh International Conference of the IEEE Engineering in Medicine and Biology Society, San Diego, 2012. [Pg.485]

With a computer-based control system one can move beyond the classical single-loop described above, and the action of a control valve can be governed by information fed from a number of points in the process. Since an understanding of both the complexities of chemical processes and advanced control theory is required, this area is at the interface between process and control engineering. [Pg.166]

The simulation framework is formed by the hierarchical structure of tool domains. Tool domain is an abstract description of interfaces of a group of tools. A domain defines the common methods for this set of tools. Tool connectors are specific implementations exposing services for a particular tool. The examples of tools connectors in the data source domain are a JDBC connector for databases or a connector for csv files. Domains are defined hierarchically to provide concepts for various groups of users, such as control engineers, operation managers, and others. In the next sections two basic domains are described—simulation domain and data source domain. The more detailed description of the simulation framework can be found in (SindeM and Novik 2011) or on (Novak et al. 2014). [Pg.265]

Example of safety controller with network to operator interface and engineering station... [Pg.165]

Ordinary diffusion involves molecular mixing caused by the random motion of molecules. It is much more pronounced in gases and Hquids than in soHds. The effects of diffusion in fluids are also greatly affected by convection or turbulence. These phenomena are involved in mass-transfer processes, and therefore in separation processes (see Mass transfer Separation systems synthesis). In chemical engineering, the term diffusional unit operations normally refers to the separation processes in which mass is transferred from one phase to another, often across a fluid interface, and in which diffusion is considered to be the rate-controlling mechanism. Thus, the standard unit operations such as distillation (qv), drying (qv), and the sorption processes, as well as the less conventional separation processes, are usually classified under this heading (see Absorption Adsorption Adsorption, gas separation Adsorption, liquid separation). [Pg.75]


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