Sputter rate input power

Figure 17.27 The dependence of the sputtering rate distribution on magnetic field strength a = 0.0 cm, 6 = 8.0 cm, input power = 10 w, / = 50mtorr.

Figure 17.32 shows the influence of input power on the Ar sputtering rate distribution. The sputtering rate increases with the increase of input power, but the distribution of the Ar sputtering rate is not uniform with respect to radial distance. Sputtering rate is a function of the energy and the number of ions that bombard the... 

Figure 17.33 The dependence of the sputtering rate distribution on input power = 280 G or 0 gauss, a = 1.5 cm, b = 8.0cm, p = 5Qmtorr, Ar flow rate = 1.0 seem.

Similar trends were found in the sputter deposition of aluminum, as is shown in Figures 14.24 and 14.25. The nearly linear proportional relationship between power and deposition rate found in the sputter deposition of Cu was not seen in the case of aluminum sputtering. Furthermore, the sputter deposition rate of copper was higher than aluminum at the same discharge power input, as would be expected from the sputtering yield data reported by Laegreid and Wehner [17]. The result is also... 

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