Indentation hardness polishing effect

Investigation of the effect of particulate properties during CMP of W showed a significant increase in the polish rate in the presence of ferric nitrate compared to the polish rate in de-ionized water, at all alumina bulk density values (shown in figure 4). Kaufmann et al. , attributed the increase in the polish rate in the presence of ferric nitrate to the "softness" of the passivating oxide film compared to W. Potentiodynamic experiments and open circuit potential measured as a function of time indicate passivation of W surface. However, the hardness values of tungsten films exposed for 5 min to 0.1 M ferric nitrate, even at the lowest load (300p,N), were the same as those of as-deposited W films within experimental error. Since a 10 nm indentation depth was observed at the lowest load, it is possible that the thickness of the oxide film is smaller and its effect does not manifest itself on the hardness measurement. 

Figure 2.11. The effect of surface preparation on the measured Vickers hardness of aluminum metal as a function of indent depth, (a) Emery paper polish, (b) Fine emery, 10 minutes, (c) Fine alumina polishing cloth, (d) Electropolished. (e) Annealed after polish.

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