High-temperature lead-free solders with method

Solder requirements are the same as for any other process. There are no ahoy composition requirements specific to laser soldering, as this soldering method is compatible with leaded or lead-free solder alloys. Even high-temperature alloys can be soldered by this technique. When single-point laser reflow is apphed, the board quality and integrity are not compromised if parameters are chosen and adequately controlled. 

The introduction of the lead-free soldering method has led to an increase in the temperature requirements of between 20-30 °C and thus created a demand for products with improved properties. The higher heat requirements for the materials used in the process may lead to increased use of high temperature thermoplastics at the expense of PBT. 

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