Resins heating

Figure 28a shows the result of SAXS on sample BrlOOO. We used Guinier s formula (see eq. 6) for the small angle scattering intensity, I(k), from randomly located voids with radius of gyration, Rg. Although Guinier s equation assumes a random distribution of pores with a homogeneous pore size, it fits our experimental data well. The slope of the solid line in Fig. 28b gives R - 5.5 A and this value has been used for the calculated curve in Fig. 28a. This suggests a relatively narrow pore-size distribution with an equivalent spherical pore diameter of about 14A. Similar results were found for the other heated resin samples, except that the mean pore diameter changed from about 12 A for samples made at 700°C to about 15 A for samples made at 1100°C.

Holdsworth, R. S., Robinson, H. W., Ebers, E. S., and Brucksch, W. F., Jr., Flame and Heat Resins for Naval Construction, Final Report under Research Contract N8-ONR-504, Task Order 1, NR033-248, Naugatuck, Conn., U. S. Rubber Co., Naugatuck Chem. Div., February 1949 (U. S. Off. Technical Serv. PB 105064). 

The structure of polyacenic polymers, one of the typical conducting polymers, has been studied by infrared (IR), X-ray diffraction and ESR [17, 18]. From these studies, it was found that polyacenic polymers obtained by heating resins are amorphous and their structures are very complicated. Therefore, their exact structures have not been clarified because of their amorphous nature and insolubility. Kurosu et al. [19] studied the relationship between the structure and electrical conductivity of polyacenic polymer samples by high resolution solid-state NMR spectroscopy. 

The plateability and hydrolytic stability advantages of polysulfone/ABS blends have been utilized to make selected appliance, plumbing, and sterilizable equipment parts, replacing polycarbonate. Polysulfone/ABS blend has also been evaluated for plateable components of electrical and electronic parts, circuit boards and connectors. However, the lack of adequate heat resistance (DTUL lower than polysulfone) for vapor phase solderability limited its use only in conjunction with other high heat resins as laminates. 

A typical manufacturing procedure for PR500 when using a heated resin pot would be ... 

Colorcomp, Custom-colored heat resins, LNP Engineering Plastics Inc. 

Example 4-6 Heating Resin in the Solids-Conveying Section of an Extruder... 

This process involves heating resin-impregnated material to... 

The new resins may be blended with a variety of additives, such as fiberglass, to make a family of amorphous high heat resins. 

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