Palladium-gold alloy films

A JEOL JSM 50A scanning electron microscope was used. Polymer surfaces were etched with a Hummer II sputtering device using argon ions and coated with a 20-nm thick sputtered film of gold/palladium alloy. 

Gold forms a continuous series of solid solutions with palladium, and there is no evidence for the existence of a miscibility gap. Also, the catalytic properties of the component metals are very different, and for these reasons the Pd-Au alloys have been popular in studies of the electronic factor in catalysis. The well-known paper by Couper and Eley (127) remains the most clearly defined example of a correlation between catalytic activity and the filling of d-band vacancies. The apparent activation energy for the ortho-parahydrogen conversion over Pd-Au wires wras constant on Pd and the Pd-rich alloys, but increased abruptly at 60% Au, at which composition d-band vacancies were considered to be just filled. Subsequently, Eley, with various collaborators, has studied a number of other reactions over the same alloy wires, e.g., formic acid decomposition 128), CO oxidation 129), and N20 decomposition ISO). These results, and the extent to which they support the d-band theory, have been reviewed by Eley (1). We shall confine our attention here to the chemisorption of oxygen and the decomposition of formic acid, winch have been studied on Pd-Au alloy films. 

Electronic Applications. The PGMs have a number of important and diverse appHcations in the electronics industry (30). The most widely used are palladium and mthenium. Palladium or palladium—silver thick-film pastes are used in multilayer ceramic capacitors and conductor inks for hybrid integrated circuits (qv). In multilayer ceramic capacitors, the termination electrodes are silver or a silver-rich Pd—Ag alloy. The internal electrodes use a palladium-rich Pd—Ag alloy. Palladium salts are increasingly used to plate edge connectors and lead frames of semiconductors (qv), as a cost-effective alternative to gold. In 1994, 45% of total mthenium demand was for use in mthenium oxide resistor pastes (see Electrical connectors). 

Industry, however, favours electrodeposited palladium-nickel alloy since it is cheaper than palladium, harder and less prone to cracking, fingerprinting and formation of polymer films Its wear resistance is poor, so it is usually given a thin topcoat of hard (sometimes, soft) gold. ... 

Another important problem is the elimination of the chemical interactions between contacting phases and also of the diffusion of metal atoms into the oxide bulk [487 89], One example is the operation of commonly used indium junctions, which are convenient because films of this soft metal and its alloys can be applied mechanically [490], This fact stimulates the quest for low-temperature techniques for junction fabrication. It is known that silver, gold, and copper, and also probably platinum [202] and palladium [487], are most suitable because of their weak interaction with HTSCs. 

The alloy catalysts used in these early studies were low surface area materials, commonly metal powders or films. The surface areas, for example, were two orders of magnitude lower than that of platinum in a commercial reforming catalyst. Hence these alloys were not of interest as practical catalysts. The systems emphasized in these studies were combinations of metallic elements that formed continuous series of solid solutions, such as nickel-copper and palladium-gold. The use of such systems presumably made it possible to vary the electronic structure of a metal crystal in a known and convenient manner, and thereby to determine its influence on catalytic activity. Bimetallic combinations of elements exhibiting limited miscibility in the bulk were not of interest. Aspects of bimetallic catalysts other than questions related to the influence of bulk electronic structure received little attention in these studies. 

Palladium has extensive use as a catalyst in hydrogenation and dehydrogenation reactions, due to its capacity of combination with hydrogen. Palladium films are used as electrical contacts in connectors. Palladium-silver and palladium-nickel alloys are used to substitute for gold in jewelry. 

---