Glass, substrate-based fabrication

Figure 13.1 Depiction of the glass-based lab-on-a-chip fabrication method. Shown in the figure is (a) the photoresist and chrome-coated glass substrate, (b) the coated substrate exposed to UV light through a mask (black rectangle), (c) removal of the exposed photoresist, (d) removal of the exposed chrome layer, (e) removal of glass by wet chemical etching, (f) removal of the bulk photoresist, and (g) removal of the bulk chrome layer.

Using the solution-based procedure, we obtain fully covered substrates, while by the //CP-based procedure, discrete areas of coverage are patterned on the substrate, which is convenient in terms of microarray fabrication because different fluorophore probes can be placed on specific, discrete regions of the same glass substrate. Such an array could then be exposed to a guest solution and subsequently the surface fluorescence emission scanned by a confocal microscope for the simultaneous acquisition of the optical data from the individually addressable areas [60-63]. 

To confirm the advantages of vertical-type EETs, OSITs using pentacene or CuPc evaporated films were fabricated on glass substrates and the basic characteristics were evaluated [15,16], as detailed in Section 10.4.3. Furthermore, OSITs based on pentacene evaporated film were fabricated... 

A CuPc layer was inserted between ITO as a source electrode and a pentacene thin film as the organic semiconductor layer in the OSIT. A band diagram for the pentacene OSIT with inserted CuPc layer is shown in Figure 10.13. For comparison, OSITs based on pentacene thin films were also fabricated directly on an ITO/glass substrate without the insertion of a CuPc layer. In addition, the dependence of the CuPc layer thickness on the characteristics of the OSITs was also investigated. It was found that the hole injection barrier was affected by the thickness of the CuPc layer, and... 

---