Fluorinated poly amide imide

Abouzari-Lotf E, Shockravi A, Javadi A. Heat-resistant and soluble fluorinated poly(amide imide)s based on non-coplanar ortho-linked diimide-dicarboxylic acid. Polym Degradation Stability 2011 96(5) 1022-8. 

Scheme 3.10 Representative structure of fluorinated poly(amide imide sulfone). Taken from Ref. [140].

Bruma et al. prepared several poly(amide imide sulfone)s [140] and investigated the thermal and dielectric properties of the polymers. The fluorinated polymer as shown in Scheme 3.10 had the lowest Tg, 279 °C, which resulted from the combined effects of meta-structures with the highest amount of flexible bridges, -SO2- and -0-, per repeat unit of the macromolecule. The dielectric constants of polymer films were in the range 3.49, close to the dielectric constant (3.2) of Kapton. This shows that introduction of hexafluoroisopropylidene units into the main chain does not significantly affect the electrical properties probably both amide and sulfone groups, which are polar, were also present in the macromolecule. 

D.-J. Liaw, C.-C. Huang, W.-H. Chen, Color lightness and highly organosoluble fluorinated polyamides, polyimides and poly(amide-imide)s based on noncoplanar 2,2 -dimethyl-4,4 -biphenylene units. Polymer 47 (7) (2006) 2337-2348. 

C.P. Yang, YY Su, M.Y. Hsu, Syntheses and properties of fluorinated polyamides and poly(amide imide)s based on 9,9-bis [4-(4-amino-2-rifluromethylphenoxy) phenyl] fluroene, aromatic dicarboxylic acids, and various mono-trimellitimides and te-trimellitimides. Colloid Polym. Sci. 284 (9) (2006) 990-1000. 

The proposed chapter reviews the work done on 6FDA based fluorinated Pis with respect to its synthesis and various copolymers, polymerisation methods, poly(ether-imide), photosensitive polyimide, hyperbranched polyimide, addition polyimide, poly(amide-imide), poly(urethane-imide), poly(epoxy-imide), poly(ester-imide), poly(siloxane-imide), nanocomposites and non-linear optical polyimides. Finally, its application in electronics and use as a material for gas separation and corrosion protection are discussed. 

As part of an effort to develop high-performance, high-temperature-resistant polymers for microelectronics applications, we also recently described a series of both partially fluorinated and nonfluorinated poly(aryl ether ketone)s containing amide, amide-imide, cyano oxadizole, or pyridazine groups and characterized their thermal and electrical properties.11... 

Fluorinated poly(imide-ether-amide)s are readily soluble in organic solvents like dimethylformamide (DMF), N-methylpyrrolidone (NMP), pyridine or tetrahydrofu-ran (THF) and give flexible films by casting of such solutions. These polymers exhibit decomposition temperatures above 360°C, and glass transition temperatures in the 221-246° C range. The polymer films have a low dielectric constant and tough mechanical properties. 

M. Bruma, F. Mercer, J. Fitch, P. Cassidy, Synthesis and characterization of fluorinated poly(imide-amide-sulfone)s, J. Appl. Polym. Sci. 56 (5) (1995) 527-532. 

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