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Flip chip technology Reliability

Several high density, but reliable termination technologies such as Ball Grid Array (BGA) and Flip Chip Bonding have been intrO duced for the high density rigid/flex. [Pg.1569]

S. Wiegele, P. Thompson, R. Lee, and E. Ramslan Reliability and Process Characterization of Electroless Nickel-Gold/Sol-der Flip Chip Interconnect Technology, Motorola, Inc. [Pg.64]

A. Schubert, R. Dudek, H. Walter, E. Jung, A. Gollhardt, B. Michel, and H. Reichl, Reliability Assessment of Flip-Chip Assemblies with Lead-Free Solder Alloys, IEEE Electronic Components and Technology Conference, 2002, p 1246-1255... [Pg.224]

Besides die attachment, ICAs are utilized in surface mount and flip-chip packages as alternatives to traditional solders. Due to their low surface tensions, ICAs are not suitable for wave soldering (Ref 6). Despite the advantages of ICA interconnection, the wide use of this technology has not been adopted by the electronics industry. The main concern is long-term reliability. [Pg.250]

Balkan, H. Patterson, D. Burgess, G. Carlson, C. Elenius, P. Johnson, M. Rooney, B. Sanchez, J. Stepniak, D. Wood, J. Flip-chip reliability Comparative characterization of lead free (Sn/Ag/Cu) and 63Sn/Pb eutectic solder. Proceedings Electronic Components and Technology Conference, San... [Pg.492]

Wu, C.M.L. Liu, J. Yeung, N.H. Reliability of ACF in flip chip with various bump height. Proceedings of the 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Helsinki, Finland, June 2000 101-106. [Pg.764]

Popelar, S. A parametric study of flip chip reliability based on solder fatigue modelling. Proceedings of the Electronics Manufacturing Technology Symposium, Twenty-Pirst lEEE/CPMT International, 1997, 299-307. [Pg.825]

See other pages where Flip chip technology Reliability is mentioned: [Pg.1771]    [Pg.481]    [Pg.427]    [Pg.453]    [Pg.1295]    [Pg.732]    [Pg.1015]    [Pg.228]    [Pg.408]    [Pg.895]    [Pg.895]    [Pg.1778]    [Pg.1549]    [Pg.108]    [Pg.107]    [Pg.251]    [Pg.365]    [Pg.60]    [Pg.144]    [Pg.127]    [Pg.736]    [Pg.740]    [Pg.761]    [Pg.764]    [Pg.817]    [Pg.228]   
See also in sourсe #XX -- [ Pg.452 ]



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