Fabrication of Single-Layer Passive Elastomeric Electronics

1 Fabrication of Single-Layer Passive Elastomeric Electronics 

Using soft hthography techniques, all design patterns are first transferred to a SU-8 layer on top of a silicon wafer from either plastic or glass masks. The thickness of the SU-8 layer may vary from a few tenths of microns to several hundred microns, depending on the design of electronic devices. Development and thermal stabihzation in order to enhance the adhesion between SU-8 layer and sflicon substrate come as the second step. In the case of 100 pm thick 

I I Silicon Hsus Q Silicone Liquid metal wafer rubber 

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