Epoxy weight

Upon selection of a specific spectrum of retardation times Xy the remaining parameters were determined by a numerical approximation technique, so as to match epoxy weight gain data at four levels of temperature. It is interesting to note that the forms of those data seem to have followed curve B in Fig. 4.2 for T = 23, 50, and 60°C but switched to curve C at T = 10°C ... 

Epoxy novolac resins are produced by glycidation of the low-molecular-weight reaction products of phenol (or cresol) with formaldehyde. Highly cross-linked systems are formed that have superior performance at elevated temperatures. 

Vinyl organosol coatings, which incorporate a high molecular weight thermoplastic PVC organosol dispersion resin, are extremely flexible. Soluble thermosetting resins, including epoxy, phenoHc, and polyesters, are added to enhance the film s product resistance and adhesion. 

Numerous avenues to produce these materials have been explored (128—138). The synthesis of two new fluorinated bicycHc monomers and the use of these monomers to prepare fluorinated epoxies with improved physical properties and a reduced surface energy have been reported (139,140). The monomers have been polymerized with the diglycidyl ether of bisphenol A, and the thermal and mechanical properties of the resin have been characterized. The resulting polymer was stable up to 380°C (10% weight loss by tga). 

Epoxies are the most commonly used adhesives (qv). Silver and gold are sometimes added to an epoxy to improve its thermal conductivity. Polyimide, also used as an adhesive, has low shrinkage as well as low viscosity and can be cured at 180°C its primary drawback is a tendency to absorb water, as much as 6% by weight. 

As the length and frequency of branches increase, they may ultimately reach from chain to chain. If all the chains are coimected together, a cross-linked or network polymer is formed. Cross-links may be built in during the polymerisation reaction by incorporation of sufficient tri- or higher functional monomers, or may be created chemically or by radiation between previously formed linear or branched molecules (curing or vulcanisation). Eor example, a Hquid epoxy (Table 1) oligomer (low molecular weight polymer) with a 6-8 is cured to a cross-linked soHd by reaction of the hydroxyl and... 

Cycloahphatic diamines react with dicarboxyUc acids or their chlorides, dianhydrides, diisocyanates and di- (or poly-)epoxides as comonomers to form high molecular weight polyamides, polyimides, polyureas, and epoxies. Polymer property dependence on diamine stmcture is greater in the linear amorphous thermoplastic polyamides and elastomeric polyureas than in the highly crosslinked thermo set epoxies (2—4). 

Wet chemical methods determining titratable amine ate reported for products entering urethane (amine number as meq/g) or epoxy (AHEW = amine hydrogen equivalent weight) trade appHcations. For secondary amines /V-nitrosamine contaminants are reportable down to ppb using Thermoelectron Corporation thermal energy analy2er techniques. 

The highly polar nature of the TGMDA—DDS system results in high moisture absorption. The plasticization of epoxy matrices by absorbed water and its effect on composite properties have been well documented. As can be seen from Table 4, the TGMDA system can absorb as much as 6.5% (by weight) water (4). This absorbed water results in a dramatic drop in both the glass transition temperature and hot—wet flexural modulus (4—6). 

Propenylphenoxy compounds have attracted much research. BMI—propenylphenoxy copolymer properties can be tailored through modification of the backbone chemistry of the propenylphenoxy comonomer. Epoxy resins may react with propenylphenol (47,48) to provide functionalized epoxies that may be low or high molecular weight, Hquid or soHd, depending on the epoxy resin employed. Bis[3-(2-propenylphenoxy)phthalimides] have been synthesized from bis(3-rutrophthalimides) and o-propenylphenol sodium involving a nucleophilic nitro displacement reaction (49). They copolymerize with bismaleimide via Diels-Alder and provide temperature-resistant networks. 

Bisphenol F Resin. Bisphenol F [2467-02-9] epoxy resin is of the same general stmcture as the epoxy phenol novolaks. Bisphenol F is 2,2Emethylene bisphenol. Whereas the epoxy phenol novolaks vary from viscous Hquids to soHd materials, the bisphenol F resin has a low viscosity (ca 4 Pa-s (40 P)) and 165 epoxy equivalent weight. Its n value (degree of polymerization) is about 0.15 and crystallization, often a problem with low viscosity conventional bisphenol A resins, is reduced with the bisphenol F resin. 

Tetrakis (4-hydroxyphenyl)ethane is prepared by reaction of glyoxal with phenol in the presence of HCl. The tetraglycidyl ether [27043-37-4] (4), mp ca 80°C, possesses a theoretical epoxide functionaUty of four with an epoxy equivalent weight of 185—208 (4). 

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