Epoxy-sealed packages

Figure 5.30 Moisture permeation through epoxy-sealed ceramic package. ...

The production test showed that the epoxy phenolic enamel was the preferred enamel for coating tinplate containers used in packaging irradiation-sterilized ham and beef. The preferred end-sealing compound for the same application was the blend of cured and uncured isobutylene-isoprene copolymer. 

The more viscous, mastic-type cements include some of the epoxies, urethanes and sflicones. Epoxies adhere well to both thermosets and thermoplastics. But epoxies are not recommended for most polyolefin bonding. Urethane adhesives have made inroads into flexible packaging, the shoe industry, and vinyl bonding. Polyester-based polyurethanes are often preferred over polyether systems because of their higher cohesive and adhesive properties. Sflicones are especially recommended where both bonding and sealing are desired. 

Adhesives in both paste and film form have been used to attach and seal ceramic or metal lids to cavity packages that may also be ceramic or metal. These packages cannot be considered hermetic in the sense that seam-sealed, welded, or soldered fids are, but they are adequate for most commercial and consumer electronics where extreme moisture-temperature environments are not encountered. Packages sealed with Epo-Tek H77 epoxy adhesive are reported to provide near-hermetic sealing of hybrid microcircuits, integrated-circuit devices, and MEM packages withstand 100 hours of 95% relative humidity."... 

Seam-welded packages/ epoxy and poor pre-seal bakeout 95.3 N/R N/R... 

Devices can be classified by package style, which can either be hermetically sealed (ceramic or metal cans) or nonhermetic (epoxy, sdicones, phenoHcs or plastic encapsulated). Materials employed in most microcircuits will change very slowly if stored in a dry environment at a constant low temperature. 

Figure 6.16 Sealing IDA packaging with water-insulating splicing epoxy. (See insert for...

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