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Epoxy resin systems Definition

The epoxy resin data and the post-cure data, taken together, show that the dipolar relaxation is associated with the temperature dependence of the polymer chain mobility in the vicinity of the glass transition. The WLF analysis of the dipolar relaxation during cure has not been carried out. In order to complete the analysis, correlated measurements of Tg, extent of cure, and dielectric properties must be made as functions of cure time and temperature. In the absence of such definitive studies, various indirect methods have been employed to analyze dielectric relaxations in curing systems, as described below. [Pg.34]

Figure 5 shows this plot for 3 different binary mixtures, as well as for a neat system (the epoxy resin PPGE). A good superposition for the a-relaxation frequency is obtained, as it is expected, since the steepness index of Za(T) m (fragility according to Angell definition ) is almost constant under pressure... [Pg.49]

See other pages where Epoxy resin systems Definition is mentioned: [Pg.250]    [Pg.268]    [Pg.144]    [Pg.47]    [Pg.1243]    [Pg.4568]    [Pg.57]    [Pg.2655]    [Pg.106]    [Pg.290]    [Pg.485]    [Pg.97]    [Pg.43]    [Pg.28]    [Pg.215]    [Pg.822]   
See also in sourсe #XX -- [ Pg.2 , Pg.3 , Pg.7 , Pg.7 ]



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