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Epoxy/epoxies glass

Fig. 2. Multilayer printed circuit board composite. Constmction is multiple layers of epoxy—glass and foil copper. Foil copper outermost layer and drilled through-holes are sequentially plated with electroless copper, electrolytic copper, electroless nickel, and electroless gold. Fig. 2. Multilayer printed circuit board composite. Constmction is multiple layers of epoxy—glass and foil copper. Foil copper outermost layer and drilled through-holes are sequentially plated with electroless copper, electrolytic copper, electroless nickel, and electroless gold.
Electrical Laminates. A significant use for epoxy resins is in the manufacture of copper-clad epoxy-glass printed circuit boards. Systems are available that meet the National Electrical Manufacturers Association (NEMA), GIO, Gil, FR3, FR4, FR5 specifications. Currently the majority of boards are manufactured to the fiame-retardant FR4 specification. The flame retardance is achieved by the use of a soHd epoxy resin based on... [Pg.371]

Poly- propylene poly- ethylene CAB" ABSf PVC Saran Polyester glass 1 Epoxy glass phenolic asbestos Fluoro- carbons Chlorinated polyether (Penton) Poly- carbonate... [Pg.2463]

Table 26.11 Mechanical properties of epoxy-glass cloth laminates... Table 26.11 Mechanical properties of epoxy-glass cloth laminates...
Property Polyester/ Glass Mat Polyester/ Woven Glass Qoth Epoxy/ Woven Glass Cloth Epoxy/ Filament Wound Glass Rovings... [Pg.120]

Thermal Expansion Phenoxy glass Epoxy-glass fiber... [Pg.342]

We should not think that heat is lost only from the copper side. The usual laminate (board material) used for SMT (surface mount technology) applications is epoxy-glass FR4, which is a fairly good conductor of heat. So some of the heat from the side on which the device is mounted does get across to the other side, where it contacts the air and helps reduce the thermal resistance. Therefore, just putting a copper plane on the other side also helps, but only by about 10 to 20%. Note that this opposite copper plane need not even be electrically the same point it could for example just be the usual ground plane. A much greater reduction of thermal resistance (by about 50 to 70%) can be produced if a cluster of small vias (thermal vias) are employed to conduct the heat from the component side to the opposite side of the PCB. [Pg.155]

See other pages where Epoxy/epoxies glass is mentioned: [Pg.131]    [Pg.131]    [Pg.426]    [Pg.129]    [Pg.137]    [Pg.532]    [Pg.112]    [Pg.948]    [Pg.1005]    [Pg.1005]    [Pg.2457]    [Pg.171]    [Pg.163]    [Pg.226]    [Pg.324]    [Pg.342]    [Pg.386]    [Pg.387]    [Pg.388]    [Pg.860]    [Pg.212]    [Pg.252]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.417]    [Pg.420]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.421]    [Pg.425]    [Pg.425]    [Pg.425]   
See also in sourсe #XX -- [ Pg.245 ]



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