Enhanced Turn-Over Package

An Enhanced Turn-Over Package (ETOP) is prepared for each of the following systems ... 

Enhanced turn-over package Installation qualification protocols Operational qualification protocols Change control initiation Cycle development Performance qualification protocol Process validation protocols Validation final reports Validation package Certificate for use in manufacturing Required protocols and procedures for dry production Required protocols and procedures for liquid and semisolid products... 

Adhesion of metals to polymers has been an intensively studied subject over the past decades This is due to the wide application of polymers to electronic packaging and, to a lesser extent, to device inter-connect The increasing demand in density for devices and speed for packaging, in turn, prompts searches for polymers with reduced dielectric constants than that of the widely used polyimide. Some fluorocarbon polymers, notably Teflon, have lower dielectric constants, 2.1, vis-i-vi the values of 3.0-3.5 for polyimides. The fluorocarbon polymers, however, have very weak adhesion to metals. An enhancement in adhesion is thus a primary requirement for the application of such polymers to technologies. A wide range of studies have been made in the past to understand and enhance the adhesion between metals and fluorocarbon polymers In this paper we review some of our earlier work, and present new observations related to the enhanced adhesion between metals and fluorocaiton polymers. We present results address three contributions to enhanced adhesion between metals and fluorocarbon polymers chemical, mechanical, and thermal. 

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